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矽基熱電複合材料及模組組裝技術
Hsin, Cheng-Lun
(PI)
電機工程學系
概覽
指紋
研究成果
(1)
指紋
探索此專案觸及的研究主題。這些標籤是根據基礎獎勵/補助款而產生。共同形成了獨特的指紋。
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Keyphrases
Thermoelectric Device
75%
Silicon Nanowire Arrays
66%
Thermoelectric
41%
Thermoelectric Properties
41%
Mg2Si
33%
Thermoelectric Module
33%
Composite Assembly
33%
Si-based
33%
Module Assembly
33%
Thermoelectric Composites
33%
Hotspot Cooling
33%
Powder Sintering
33%
Powder Milling
33%
Ag Paste
33%
Time Enhancement
33%
Silicon Nanowires (SiNWs)
33%
Polyimide
33%
Milling Process
33%
Nanowires
33%
Silicide
33%
Sintering Process
33%
ZT Value
33%
Thermoelectric Applications
33%
P-type
33%
Submillimeter
33%
Nanodevices
33%
Mechanical Strength
33%
Cost-effective Approach
33%
Waste Heat
33%
Si-SiO2
16%
Heat Flow
16%
Room Temperature
16%
SiO2 Nanopowder
16%
Thermoelectric Nanocomposites
8%
Thermoelectric Effect
8%
Device-based Measures
8%
Material Growth
8%
Body Heat
8%
Charge Transport
8%
Material Design
8%
Thermal Energy
8%
Mass Production
8%
Wearable Electronics
8%
Eco-friendly
8%
Measurement Platform
8%
Flow Transport
8%
Composite Thermoelectrics
8%
Elderly Society
8%
Microelectronics
8%
Sintering Processing
8%
Property Measurement
8%
Battery Life
8%
Design Construction
8%
Material Science
Thermoelectrics
100%
Silicon
66%
Nanowire
66%
Composite Material
33%
Sintering
17%
Powder Milling
13%
Polyimide
13%
Device Type
13%
Nanodevice
13%
Silicide
13%
Strength of Materials
13%
Nanopowder
7%