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奈米尺度電化學界面的研究
Yau, Shueh-Lin
(PI)
化學學系
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探索此專案觸及的研究主題。這些標籤是根據基礎獎勵/補助款而產生。共同形成了獨特的指紋。
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Keyphrases
Polyethylene Glycol
100%
Electrified Interface
100%
Nanometer Scale
100%
Electrocatalyst
50%
Electrocatalysis
50%
Electrodeposition
50%
Fuel Cell
50%
Electroplating
50%
Cu Deposition
50%
Electrocatalyses
50%
Copper-cobalt
25%
Preparative Method
25%
Silicon chip
25%
Surfactant Adsorption
25%
Superconformal
25%
Electroplating Technology
25%
Regent
25%
Disulfide
25%
Scanning Probe
25%
Oxygen Reduction Reaction
25%
Gold Electrode
25%
Electroplating Bath
25%
Nickel Electrodeposition
25%
Processing Technology
25%
Interfacial Chemistry
25%
Scanning Tunneling Microscopy
25%
Taiwanese
25%
Thickness Control
25%
Chloride Anion
25%
Electrocatalytic Activity
25%
Electrodeposition Method
25%
Cu Plating
25%
Precision Control
25%
Co Films
25%
Electronic Devices
25%
Metallization
25%
Redox Reaction
25%
Chemical Energy
25%
Attenuated Total Reflection
25%
Copper Electrodeposition
25%
In Situ Scanning Tunneling Microscopy
25%
Electropolymerization
25%
Methanol Oxidation
25%
Metallic Materials
25%
Morphological Structure
25%
Copper-nickel
25%
Ni Film
25%
Formic Acid Oxidation
25%
Adatoms
25%
Material Science
Polyethylene Glycol
100%
Electrodeposition
100%
Electroplating
75%
Electrocatalysis
50%
Electrocatalysts
50%
Scanning Tunneling Microscopy
50%
Redox Process
25%
Silicon
25%
Anode
25%
Film
25%
Plating
25%
Monolayers
25%
Cobalt
25%
Electropolymerization
25%
Surface Active Agent
25%
Platinum
25%
Chemical Engineering
Electrodeposition
100%
Polyethylene Glycol
57%
Surfactant
14%
Electropolymerization
14%
Formic Acid
14%
Film
14%
Methanol Oxidation Reaction
14%
Metallizing
14%