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撓曲變形對軟性電子導電與封裝薄膜功能性質之影響(3/3)
Lin, Chih-Kuang
(PI)
機械工程學系
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Keyphrases
Applied Load
14%
Barrier Structure
14%
Bending Test
14%
Combined Bending
14%
Combined Test
14%
Commercial Application
14%
Competitive Cost
14%
Competitive Engineering
14%
Corrosion Test
14%
Creep-fatigue
28%
Delamination
14%
Electric Conductance
14%
Electrical Conductivity
14%
Electrical Conductivity Properties
14%
Electrical Resistance
14%
Electronic Conductivity
14%
Electronics Assembly
14%
Engineering Requirements
14%
Failure Mechanism
14%
Finite Element Method Model
14%
Finite Element Method Modeling
14%
Flex
28%
Flexible Electronic Devices
71%
Flexible Electronics
100%
Flexible Organic Devices
14%
Flexural Deformation
100%
Flexural Fatigue
14%
Flexural Loading
14%
Functional Layer
14%
Functional Properties
100%
High Transparency
14%
Indium Tin Oxide Film
14%
Indium Tin Oxide Thin Film
42%
Induced Damage
14%
Light-transmitting
14%
Major Components
14%
Mechanical Behavior
28%
Mechanical Integrity
14%
Mechanical Testing
14%
Microcracks
14%
Moisture Permeation
14%
Organic Light-emitting Diodes
28%
Organic Photovoltaics
28%
Organic Semiconducting Material
14%
Organic Thin-film Transistors
14%
Permeation Mechanism
14%
Polyethylene Naphthalate
14%
Polyethylene Terephthalate
14%
Polymer Substrate
28%
Structural Reliability
14%
Thin Barrier
14%
Thin Film Electrode
28%
Thin Film Encapsulation
14%
Transparent Conductive Thin Film
57%
Transparent Electrode
14%
Transportation Rate
42%
Water Vapor
14%
Water Vapor Transportation
57%
Engineering
Bending Tests
6%
Combined Bending
6%
Conductive
100%
Creep
13%
Delamination
6%
Desired Shape
6%
Electrical Conductivity
6%
Engineering
6%
Failure Mechanism
6%
Finite Element Analysis
13%
Flexible Electronics
100%
Functional Layer
6%
Functional Property
100%
Indium-Tin-Oxide
26%
Induced Damage
6%
Major Component
6%
Mechanical Property
13%
Mechanical Testing
6%
Microcracking
6%
Moisture Permeation
6%
Organic Light-Emitting Diode
13%
Organic Solar Cells
13%
Oxide Film
6%
Semiconducting Material
6%
Structural Reliability
6%
Thin Films
100%
Thin-Film Transistor
6%
Material Science
Corrosion
6%
Creep
13%
Delamination
6%
Electrical Conductivity
6%
Electrical Resistance
6%
Finite Element Method
13%
Indium Tin Oxide
26%
Light-Emitting Diode
13%
Mechanical Property
13%
Mechanical Testing
6%
Microcracking
6%
Organic Solar Cells
13%
Oxidation Reaction
6%
Oxide Film
6%
Polyethylene
6%
Polyethylene Terephthalate
6%
Semiconducting Material
6%
Thin Films
100%
Thin-Film Transistor
6%
Water Vapor
33%