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低溫無鉛銲料之開發與低溫接合晶片翹曲之研究(3/3)
吳, 子嘉
(PI)
化學工程與材料工程學系
概覽
指紋
研究成果
(2)
指紋
探索此專案觸及的研究主題。這些標籤是根據基礎獎勵/補助款而產生。共同形成了獨特的指紋。
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重量
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Engineering & Materials Science
Annealing
94%
Atoms
24%
Compaction
20%
Diffraction patterns
33%
Electrons
23%
Gibbs free energy
32%
Intermetallics
75%
Melting
67%
Microstructure
16%
Oxides
20%
Phase interfaces
35%
Phase separation
61%
Shear strength
23%
Soldering alloys
23%
Substrates
67%
Surface chemistry
93%
Temperature
9%
Thermodynamics
20%
Transmission electron microscopy
24%
X ray diffraction
70%
X ray photoelectron spectroscopy
29%
X rays
21%
Physics & Astronomy
annealing
57%
atoms
12%
chips
66%
diffraction
25%
diffraction patterns
19%
diffusivity
22%
electron probes
26%
electronic packaging
16%
Gibbs free energy
28%
grazing
55%
grazing incidence
25%
industries
9%
integrated circuits
5%
intermetallics
64%
low weight
32%
melting
55%
microstructure
17%
oxides
14%
packaging
6%
photoelectron spectroscopy
19%
proposals
5%
shear
16%
shear strength
27%
solders
66%
synchrotron radiation
5%
temperature
8%
thermodynamics
16%
transmission electron microscopy
15%
voids
20%
wafers
8%
warpage
26%
x rays
56%
Chemical Compounds
Alloy
100%
Annealing
74%
Diffusion
58%
Electron Particle
12%
Gibbs Free Energy
18%
Intermetallic Compound
76%
Liquid Film
34%
Melting
61%
Microstructure
16%
Phase Interface
27%
Phase Separation
41%
Probe
14%
Reaction Yield
9%
Shear
21%
Shear Strength
27%
Solder
29%
Surface
7%
Surface Chemistry
65%
Thermodynamics
14%
Transmission Electron Microscopy
15%
Weight
12%
X-Ray
14%
X-Ray Diffraction
35%
X-Ray Photoelectron Spectroscopy
16%