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低溫無鉛銲料之開發與低溫接合晶片翹曲之研究(3/3)
吳, 子嘉
(PI)
化學工程與材料工程學系
概覽
指紋
研究成果
(2)
指紋
探索此專案觸及的研究主題。這些標籤是根據基礎獎勵/補助款而產生。共同形成了獨特的指紋。
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Engineering & Materials Science
Annealing
94%
Surface chemistry
93%
Intermetallics
75%
X ray diffraction
70%
Melting
67%
Substrates
67%
Phase separation
61%
Phase interfaces
35%
Diffraction patterns
33%
Gibbs free energy
32%
X ray photoelectron spectroscopy
29%
Atoms
24%
Transmission electron microscopy
24%
Electrons
23%
Soldering alloys
23%
Shear strength
23%
X rays
21%
Thermodynamics
20%
Oxides
20%
Compaction
20%
Microstructure
16%
Temperature
9%
Physics & Astronomy
solders
66%
chips
66%
intermetallics
64%
annealing
57%
x rays
56%
melting
55%
grazing
55%
low weight
32%
Gibbs free energy
28%
shear strength
27%
electron probes
26%
warpage
26%
diffraction
25%
grazing incidence
25%
diffusivity
22%
voids
20%
diffraction patterns
19%
photoelectron spectroscopy
19%
microstructure
17%
electronic packaging
16%
shear
16%
thermodynamics
16%
transmission electron microscopy
15%
oxides
14%
atoms
12%
industries
9%
wafers
8%
temperature
8%
packaging
6%
integrated circuits
5%
proposals
5%
synchrotron radiation
5%
Chemical Compounds
Alloy
100%
Intermetallic Compound
76%
Annealing
74%
Surface Chemistry
65%
Melting
61%
Diffusion
58%
Phase Separation
41%
X-Ray Diffraction
35%
Liquid Film
34%
Solder
29%
Shear Strength
27%
Phase Interface
27%
Shear
21%
Gibbs Free Energy
18%
X-Ray Photoelectron Spectroscopy
16%
Microstructure
16%
Transmission Electron Microscopy
15%
Thermodynamics
14%
Probe
14%
X-Ray
14%
Electron Particle
12%
Weight
12%
Reaction Yield
9%
Surface
7%