常壓低溫銅接合技術(1/3)

Physics & Astronomy

1. sintering 100%
2. copper 46%
3. nanoparticles 43%
4. circuit boards 39%
5. microstructure 38%
6. polymers 37%
7. ambient temperature 31%
8. acids 29%
9. tomography 25%
10. wire 24%
11. ceramics 21%
12. transmission electron microscopy 21%
13. x rays 14%
14. temperature 9%