每年研究成果
每年研究成果
- 7結果
搜尋結果
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2022
Computational Screening and Multiscale Simulation of Barrier-Free Contacts for 2D Semiconductor pFETs
Yang, N., Lin, Y. C., Chuu, C. P., Rahman, S., Wu, T., Chou, A. S., Liew, S. L., Fujiwara, K., Chen, H. Y., Ikeda, J., Tsukazaki, A., Hou, D. H., Woon, W. Y., Liao, S., Huang, S., Qian, X., Guo, J., Radu, I., Philip Wong, H. S. & Wang, H., 2022, 2022 International Electron Devices Meeting, IEDM 2022. Institute of Electrical and Electronics Engineers Inc., p. 2811-2814 4 p. (Technical Digest - International Electron Devices Meeting, IEDM; 卷 2022-December).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
3 引文 斯高帕斯（Scopus） -
High-Performance Monolayer WSe2 p/n FETs via Antimony-Platinum Modulated Contact Technology towards 2D CMOS Electronics
Chou, A. S., Lin, Y. T., Lin, Y. C., Hsu, C. H., Li, M. Y., Liew, S. L., Chou, S. A., Chen, H. Y., Chiu, H. Y., Ho, P. H., Hsu, M. C., Hsu, Y. W., Yang, N., Woon, W. Y., Liao, S., Hou, D. H., Chien, C. H., Chang, W. H., Radu, I., Wu, C. I., 及其他2, 2022, 2022 International Electron Devices Meeting, IEDM 2022. Institute of Electrical and Electronics Engineers Inc., p. 721-724 4 p. (Technical Digest - International Electron Devices Meeting, IEDM; 卷 2022-December).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
3 引文 斯高帕斯（Scopus） -
SiC structural characterization by non destructive near-field microscopy techniques
Wu, K. T., Vuillermet, E., Usureau, E., El-Helou, Y., Kazan, M., Woon, W. Y., Lazar, M. & Bruyant, A., 2022, 2022 International Semiconductor Conference, CAS 2022. Institute of Electrical and Electronics Engineers Inc., p. 73-76 4 p. (Proceedings of the International Semiconductor Conference, CAS; 卷 2022-October).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
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Wafer-Scale Bi-Assisted Semi-Auto Dry Transfer and Fabrication of High-Performance Monolayer CVD WS2Transistor
Li, M. Y., Hsu, C. H., Shen, S. W., Chou, A. S., Lin, Y. C., Chuu, C. P., Yang, N., Chou, S. A., Huang, L. Y., Cheng, C. C., Woon, W. Y., Liao, S., Wu, C. I., Li, L. J., Radu, I., Wong, H. S. P. & Wang, H., 2022, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., p. 290-291 2 p. (Digest of Technical Papers - Symposium on VLSI Technology; 卷 2022-June).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
8 引文 斯高帕斯（Scopus） -
2019
Ionic concentration sensing via nitrogen modified graphene through low-damage plasma treatment
Tsai, M. H., Hsuan Lin, C., Huang, C. H., Yen Woon, W. & Lin, C. T., 10月 2019, 2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 8956821. (Proceedings of IEEE Sensors; 卷 2019-October).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
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2016
Controlling dipole orientation near a dielectric interface via a buffer layer
Ho, X. L., Chen, P. J., Woon, W. Y. & White, J. D., 2016, Frontiers in Optics, FiO 2016. Optica Publishing Group (formerly OSA), (Optics InfoBase Conference Papers).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
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2005
Dynamics of structural rearrangement in dusty plasma liquids
Huang, Y. S., Chan, C. L., Woon, W. Y. & I, L., 31 10月 2005, NEW VISTAS IN DUSTY PLASMAS: Fourth International Conference on the Physics of Dusty Plasmas. p. 12-19 8 p. (AIP Conference Proceedings; 卷 799).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審