搜尋結果
2023
Lai, Y. Y. ,
Chao, J. L. ,
Hsu, C. J. ,
Wang, C. M. &
Wu, A. T. ,
2月 2023 ,
於: Journal of Electronic Materials. 52 ,
2 ,
p. 782-791 10 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Solder
100%
solders
90%
Soldering alloys
79%
Temperature
32%
Application
25%
2022
Lin, S. W. ,
Chao, J. L. ,
Ku, S. C. ,
Li, N. &
Wu, A. T. ,
9月 2022 ,
於: Journal of the Taiwan Institute of Chemical Engineers. 138 , 104480.
研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Corrosion
100%
Corrosion resistance
81%
Corrosion Resistance
78%
Atomic Diffusion
72%
Consumer products
56%
Sun, Z. W. ,
Cheng, K. W. ,
Lin, S. W. ,
Ranganayakulu, V. K. ,
Chen, Y. Y. ,
Chiu, S. J. ,
Lee, T. W. &
Wu, A. T. ,
27 6月 2022 ,
於: ACS Applied Energy Materials. 5 ,
6 ,
p. 7026-7033 8 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Thermoelectricity
100%
Thin films
85%
Antimony
65%
Stoichiometry
60%
Liquid Film
43%
2021
Liu, W. ,
Wang, H. ,
Huang, K. S. ,
Wang, C. M. &
Wu, A. T. ,
8月 2021 ,
於: Journal of the Taiwan Institute of Chemical Engineers. 125 ,
p. 394-401 8 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Nanoparticles
100%
Polyethylene glycols
87%
Green
69%
Oxides
57%
Poly(ethylene Glycol)
53%
Huang, K. S. ,
Shen, T. H. ,
Liu, W. ,
Chao, J. L. &
Wu, A. T. ,
1 11月 2021 ,
於: Materials Chemistry and Physics. 272 , 124966.
研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Intermetallic Compound
100%
Intermetallics
98%
intermetallics
83%
solid state
70%
Shear Strength
53%
2020
Liao, Y. H. ,
Chen, C. H. ,
Liang, C. L. ,
Lin, K. L. &
Wu, A. T. ,
11月 2020 ,
於: Acta Materialia. 200 ,
p. 200-210 11 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Electromigration
100%
Crystallinity
94%
Electric properties
82%
Electrical Property
65%
Microstructure
52%
Wang, C. H. ,
Hsieh, H. C. ,
Sun, Z. W. ,
Ranganayakulu, V. K. ,
Lan, T. W. ,
Chen, Y. Y. ,
Chang, Y. Y. &
Wu, A. T. ,
17 6月 2020 ,
於: ACS Applied Materials and Interfaces. 12 ,
24 ,
p. 27001-27009 9 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Diffusion barriers
100%
Bismuth
90%
Surface chemistry
89%
Thermoelectricity
75%
Intermetallics
71%
Hsieh, H. C. ,
Wang, C. H. ,
Lan, T. W. ,
Lee, T. H. ,
Chen, Y. Y. ,
Chu, H. S. &
Wu, A. T. ,
1 5月 2020 ,
於: Materials Chemistry and Physics. 246 , 122848.
研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Diffusion barriers
100%
Diffusion Barrier
85%
thermoelectric materials
76%
Thermoelectricity
75%
barrier layers
73%
2019
Wang, C. H. ,
Hsieh, H. C. ,
Lee, H. Y. &
Wu, A. T. ,
15 1月 2019 ,
於: Journal of Electronic Materials. 48 ,
1 ,
p. 53-57 5 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Waste Heat
100%
Diffusion barriers
97%
Diffusion Barrier
82%
Solder
81%
thermoelectric materials
74%
Printed circuits
100%
automobiles
95%
printed circuits
95%
submerging
79%
Automobiles
72%
Lin, W. C. ,
Tseng, T. H. ,
Liu, W. ,
Huang, K. S. ,
Chen, H. ,
Lee, H. Y. ,
Ku, C. S. &
Wu, A. T. ,
15 9月 2019 ,
於: JOM. 71 ,
9 ,
p. 3041-3048 8 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Grain Size
100%
Liquid Film
51%
Thick films
21%
Microstructure
11%
Dimension
11%
Zhang, Z. ,
Chen, C. ,
Wu, A. T. &
Suganuma, K. ,
1 11月 2019 ,
於: Journal of Materials Science: Materials in Electronics. 30 ,
22 ,
p. 20292-20301 10 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Thermal Aging
100%
Thermal aging
94%
Preheating
43%
Substrates
33%
Temperature
30%
Tseng, T. H. ,
Yang, C. H. ,
Chiang, J. Y. ,
Huang, J. J. ,
Chen, C. H. ,
Lin, S. K. ,
Wang, C. M. &
Wu, A. T. ,
24 6月 2019 ,
於: Materials Science and Engineering A. 759 ,
p. 506-513 8 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Surface chemistry
100%
Intermetallic Compound
81%
Intermetallics
80%
Melting
72%
Surface Chemistry
69%
2018
Lin, P. C. ,
Chen, H. ,
Hsieh, H. C. ,
Tseng, T. H. ,
Lee, H. Y. &
Wu, A. T. ,
1 6月 2018 ,
於: Materials Chemistry and Physics. 211 ,
p. 17-22 6 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Annealing
100%
Phase separation
86%
chips
79%
grazing
78%
Alloy
70%
Wu, H. J. ,
Wu, A. T. ,
Wei, P. C. &
Chen, S. W. ,
3 4月 2018 ,
於: Materials Research Letters. 6 ,
4 ,
p. 244-248 5 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Diffusion barriers
100%
Surface chemistry
89%
Thermoelectricity
75%
Surface Chemistry
62%
Interdiffusion
52%
Diffusion barriers
100%
Diffusion Barrier
85%
Solder
83%
solders
75%
Thermoelectricity
75%
Wang, S. H. ,
Liu, J. H. ,
Chung, P. T. ,
Chiang, A. S. T. ,
Wu, A. T. C. ,
Liu, Y. L. ,
Wu, K. Y. &
Chang, S. J. ,
2018 ,
於: Recent Innovations in Chemical Engineering. 11 ,
3 ,
p. 160-171 12 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Zirconia
100%
Nanocomposites
90%
Acrylate
75%
Nanocomposite
55%
Nanocrystals
50%
2017
Lin, B. C. ,
Ku, C. S. ,
Lee, H. Y. ,
Chakroborty, S. &
Wu, A. T. ,
31 12月 2017 ,
於: Applied Surface Science. 426 ,
p. 224-228 5 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Atomic layer deposition
100%
Nanorods
97%
interruption
78%
Atomic Layer Epitaxy
75%
atomic layer epitaxy
67%
Chen, C. H. ,
Chakroborty, S. ,
Lee, B. H. ,
Chen, H. C. ,
Wang, C. M. &
Wu, A. T. ,
21 12月 2017 ,
於: Materials Science and Engineering A. 708 ,
p. 142-148 7 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Tin
100%
Shear Strength
98%
shear strength
98%
Melting point
90%
Shear strength
83%
Huang, Y. T. ,
Chen, C. H. ,
Chakroborty, S. &
Wu, A. T. ,
1 9月 2017 ,
於: JOM. 69 ,
9 ,
p. 1717-1723 7 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Electromigration
100%
Solder
96%
Soldering alloys
76%
Electron Backscatter Diffraction
37%
Three dimensional integrated circuits
36%
Phase separation
100%
Sputtering
99%
Strength of materials
80%
Thin films
73%
Phase Separation
67%
Hsieh, H. C. ,
Wang, C. H. ,
Lin, W. C. ,
Chakroborty, S. ,
Lee, T. H. ,
Chu, H. S. &
Wu, A. T. ,
2017 ,
於: Journal of Alloys and Compounds. 728 ,
p. 1023-1029 7 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Diffusion barriers
100%
Diffusion Barrier
85%
Thermoelectricity
56%
Electrodes
52%
Behavior as Electrode
34%
Nanorods
100%
Epitaxial growth
94%
Microspheres
89%
Epitaxial Growth
81%
Lithography
73%
2016
electric current
100%
solders
36%
matrices
36%
diffraction
35%
coalescing
31%
Lead-free solders
100%
Solder
99%
Spalling
98%
Shear Strength
93%
Intermetallic Compound
86%
Chen, H. ,
Lee, H. Y. ,
Ku, C. S. &
Wu, A. T. ,
1 4月 2016 ,
於: Journal of Materials Science. 51 ,
7 ,
p. 3600-3606 7 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Residual Stress
100%
Qualitative Analysis
82%
Stress analysis
76%
Residual stresses
65%
Microstructure
50%
Huang, Y. T. ,
Chen, C. H. ,
Lee, B. H. ,
Chen, H. C. ,
Wang, C. M. &
Wu, A. T. ,
1 12月 2016 ,
於: Journal of Electronic Materials. 45 ,
12 ,
p. 6163-6170 8 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Three dimensional integrated circuits
100%
Electromigration
92%
Solder
88%
electromigration
84%
solders
80%
Ouyang, Y. T. ,
Hsieh, H. C. ,
Lin, P. C. ,
Tseng, T. H. ,
Ku, C. S. ,
Lee, H. Y. &
Wu, A. T. ,
1 12月 2016 ,
於: Materials Letters. 184 ,
p. 308-311 4 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Nanocrystals
100%
Photodiodes
83%
Optical band gaps
66%
photodiodes
60%
nanocrystals
59%
2015
Hsu, H. H. ,
Huang, Y. T. ,
Huang, S. Y. ,
Chang, T. C. &
Wu, A. T. ,
5 10月 2015 ,
於: Journal of Electronic Materials. 44 ,
10 ,
p. 3888-3895 8 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Three dimensional integrated circuits
100%
Solder
88%
Intermetallic Compound
76%
Intermetallics
75%
Soldering alloys
70%
Liao, Y. H. ,
Liang, C. L. ,
Lin, K. L. &
Wu, A. T. ,
1 12月 2015 ,
於: AIP Advances. 5 ,
12 , 127210.
研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
electric current
100%
tin
92%
deflection
29%
refining
18%
strip
14%
Hsu, H. H. ,
Chen, H. ,
Ouyang, Y. T. ,
Chiu, T. C. ,
Chang, T. C. ,
Lee, H. Y. ,
Ku, C. S. &
Wu, A. T. ,
5 10月 2015 ,
於: Journal of Electronic Materials. 44 ,
10 ,
p. 3942-3947 6 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Synchrotrons
100%
strain distribution
88%
X ray diffraction
74%
synchrotrons
65%
Substrates
53%
Ouyang, Y. T. ,
Su, C. H. ,
Chang, J. Y. ,
Cheng, S. L. ,
Lin, P. C. &
Wu, A. T. ,
15 9月 2015 ,
於: Applied Surface Science. 349 ,
p. 387-392 6 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Nanocrystals
100%
Photodiodes
83%
photodiodes
60%
nanocrystals
59%
Nanocrystal
54%
Crystal structure
100%
Crystals
77%
X ray diffraction
76%
Alloy
54%
Crystal orientation
53%
2014
Liu, C. Y. ,
Hsu, Y. C. ,
Hu, Y. J. ,
Huang, T. S. ,
Lu, C. T. &
Wu, A. T. ,
2014 ,
於: ECS Solid State Letters. 3 ,
2 ,
p. P17-P19 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Solder
100%
Cathodes
80%
Fluxes
65%
Cathode
59%
Force
54%
Hu, Y. J. ,
Hsu, Y. C. ,
Huang, T. S. ,
Lu, C. T. ,
Wu, A. T. &
Liu, C. Y. ,
1月 2014 ,
於: Journal of Electronic Materials. 43 ,
1 ,
p. 170-175 6 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Solder
100%
solders
90%
Soldering alloys
79%
chips
64%
Microstructure
54%
electromigration
100%
solders
94%
integrated circuits
80%
intermetallics
60%
electrodes
42%
Hsu, H. H. ,
Chiu, T. C. ,
Chang, T. C. ,
Huang, S. Y. ,
Lee, H. Y. ,
Ku, C. S. ,
Lin, Y. Y. ,
Su, C. H. ,
Chou, L. W. ,
Ouyang, Y. T. ,
Huang, Y. T. &
Wu, A. T. ,
1月 2014 ,
於: Journal of Electronic Materials. 43 ,
1 ,
p. 52-56 5 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Synchrotrons
100%
Strain measurement
91%
strain measurement
87%
Synchrotron Radiation
80%
Thermal Expansion
80%
Su, C. H. ,
Chen, H. ,
Lee, H. Y. ,
Liu, C. Y. ,
Ku, C. S. &
Wu, A. T. ,
9月 2014 ,
於: Journal of Electronic Materials. 43 ,
9 ,
p. 3290-3295 6 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Oxides
100%
Atomic Diffusion
95%
Diffractometry
79%
Residual Stress
77%
oxides
72%
Chien, P. Y. ,
Yeh, C. H. ,
Hsu, H. H. &
Wu, A. T. ,
1月 2014 ,
於: Journal of Electronic Materials. 43 ,
1 ,
p. 284-289 6 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Nickel-Phosphorus
100%
bismuth tellurides
90%
Bismuth
85%
Electromigration
81%
Peltier Effect
79%
2013
Chen, W. Y. ,
Chiu, T. C. ,
Lin, K. L. ,
Wu, A. T. ,
Jang, W. L. ,
Dong, C. L. &
Lee, H. Y. ,
3月 2013 ,
於: Scripta Materialia. 68 ,
5 ,
p. 317-320 4 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Thermal Aging
100%
Thermal aging
94%
Solder
92%
solders
83%
Dissolution
79%
Lin, Y. Y. ,
Lee, H. Y. ,
Ku, C. S. ,
Chou, L. W. &
Wu, A. T. ,
18 3月 2013 ,
於: Applied Physics Letters. 102 ,
11 , 111912.
研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
antimony
100%
tin oxides
86%
vapor deposition
68%
atmospheres
63%
chlorine
47%
Chiu, Y. T. ,
Lin, K. L. ,
Wu, A. T. ,
Jang, W. L. ,
Dong, C. L. &
Lai, Y. S. ,
5 2月 2013 ,
於: Journal of Alloys and Compounds. 549 ,
p. 190-194 5 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Nanorods
100%
Supersaturation
66%
Nanorod
57%
Solder
55%
Crystals
44%
Tin oxides
100%
spraying
82%
Spraying
82%
Tin Oxide
77%
Solar cells
76%
Interfacial energy
100%
Solder
99%
Spalling
98%
Intermetallic Compound
86%
Intermetallics
85%
2012
Lin, Y. Y. ,
Wu, A. T. ,
Ku, C. S. &
Lee, H. Y. ,
10月 2012 ,
於: Japanese Journal of Applied Physics. 51 ,
10 PART 2 , 10NE28.
研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Antimony
100%
Tin oxides
95%
Synchrotrons
91%
Oxide films
85%
Chlorine
84%
Tsai, C. Y. ,
Lou, B. Y. ,
Hsu, H. H. &
Wu, A. T. ,
16 1月 2012 ,
於: Materials Chemistry and Physics. 132 ,
1 ,
p. 162-165 4 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Metallic films
100%
Intermetallic Compound
63%
Intermetallics
63%
Thin films
56%
intermetallics
53%
Yeh, C. N. ,
Yang, K. ,
Lee, H. Y. &
Wu, A. T. ,
1月 2012 ,
於: Journal of Electronic Materials. 41 ,
1 ,
p. 159-165 7 p. 研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
Crystallization
100%
Crystallization Behavior
97%
Eutectics
96%
Ink
93%
Extrusion
89%
Diffusion barriers
100%
Diffusion Barrier
85%
Lead-free solders
83%
thermoelectric materials
76%
solders
75%
Diffusion barriers
100%
Diffusion Barrier
85%
Intermetallic Compound
72%
Intermetallics
71%
intermetallics
60%
Diffusion barriers
100%
Surface chemistry
89%
Diffusion Barrier
85%
thermoelectric materials
76%
Intermetallic Compound
72%