吳 子嘉

教授, 化學工程與材料工程學系系主任

按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
20042023

每年研究成果

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會議論文篇章

搜尋結果

  • 2019

    Corrosion resistance of surface finishes for high reliability devices

    Tseng, T. H. & Wu, A. T., 24 1月 2019, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 206-209 4 p. 8625719. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2018

    Development of low temperature solder alloys for advanced electronic packaging: Assessment of In-Bi alloys on Cu substrates

    Wu, A. T., Chen, C. H., Huang, J. J., Chiang, J. Y. & Wang, C. M., 6 6月 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 128-131 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    2 引文 斯高帕斯(Scopus)
  • 2016

    Creep corrosion on high reliability printed circuit boards

    Tseng, T. H., Wu, A. T., Chang, Y. T., Shi, H. C. & Lee, J., 27 12月 2016, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 156-158 3 p. 7800024. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    1 引文 斯高帕斯(Scopus)
  • Development of New Low Melting Solder Alloys

    Chen, C. H., Lee, B. H., Chen, H. C., Wang, C. M. & Wu, A. T., 16 8月 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 2501-2506 6 p. 7545777. (Proceedings - Electronic Components and Technology Conference; 卷 2016-August).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    1 引文 斯高帕斯(Scopus)
  • Non-destructive testing method for chip warpage -Applications of synchrotron radiation X-ray

    Hsu, H. H., Wang, C. M., Lee, H. Y. & Wu, A. T., 7 6月 2016, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 15-18 4 p. 7486772. (2016 International Conference on Electronics Packaging, ICEP 2016).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2015

    Massive spalling in Pb-free solder on co-based surface finishes

    Huang, C. H., Tsai, Y. L., Chang, Y. T. & Wu, A. T., 20 5月 2015, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 586-589 4 p. 7111082. (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    1 引文 斯高帕斯(Scopus)
  • 2011

    Analysis of antimony doped SnO 2 thin film by synchrotron grazing incidence X-ray diffraction

    Lin, Y. Y., Wu, A. T., Ku, C. S. & Lee, H. Y., 2011, Program - 37th IEEE Photovoltaic Specialists Conference, PVSC 2011. p. 1768-1770 3 p. 6186296. (Conference Record of the IEEE Photovoltaic Specialists Conference).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2010

    Electrical current induced local thermal stress caused on stacked 3D-ICs

    Hsu, H. H., Chang, T. C., Chen, C., Lee, H. Y. & Wu, A. T., 2010, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699582. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    1 引文 斯高帕斯(Scopus)
  • The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation x-ray

    Hsu, H. H., Chang, T. C., Chen, C., Lee, H. Y. & Wu, A. T., 2010, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699581. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2008

    The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates

    Chen, M. H., Jieng, Y. Y. & Wu, A. T., 2008, 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. p. 209-211 3 p. 4783846. (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2005

    Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction

    Wu, A. T., Lloyd, J. R., Tamura, N. & Tu, K. N., 2005, Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces. p. 178-180 3 p. 1432073. (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces; 卷 2005).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    1 引文 斯高帕斯(Scopus)