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查看斯高帕斯 (Scopus) 概要
吳 子嘉
教授, 工學院副院長
化學工程與材料工程學系
電子郵件
atwu
ncu.edu
tw
網站
http://www.cme.ncu.edu.tw/products_detail/25.htm
h-index
1326
引文
21
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
2004
2024
每年研究成果
概覽
指紋
網路
研究計畫
(25)
研究成果
(93)
類似的個人檔案
(6)
指紋
查看啟用 Tzu-Chia Wu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Keyphrases
3D IC
30%
Ag3Sn
13%
Amorphous InGaZnO (a-IGZO)
15%
Annealing
14%
Bismuth Telluride
24%
Co-based
12%
Co-sputtering
11%
Cu Substrate
35%
Cu-Sn
10%
Cu6Sn5
17%
Current Density
15%
Current Stressing
25%
Diffusion Barrier
35%
Electric Current
11%
Electrical Current
18%
Electroless
16%
Electroless Cobalt
9%
Electromigration
55%
Grazing Incidence X-ray Diffraction (GIXRD)
11%
High Reliability
11%
In Situ
12%
In Situ Synchrotron X-ray Diffraction
11%
Interfacial Reaction
27%
Intermetallic Compounds
72%
Kinetic Analysis
14%
Low Temperature
12%
Massive Spalling
12%
Mechanical Strength
13%
Microbump
14%
Microstructure
19%
Microstructure Evolution
13%
Ni-Sn
12%
Ni3S4
12%
NiTe
9%
Pb-free Solder
16%
Shear Test
10%
Sn Whisker
18%
Solder Alloys
17%
Solder Joint
12%
Soldering
64%
Surface Finish
31%
Synchrotron Radiation X-ray
26%
Synchrotron X-ray
12%
Thermal Stress
13%
Thermoelectric Materials
25%
Thermoelectric Module
14%
Tin Oxide Thin Film
10%
Tin Whisker
13%
Whisker
18%
Whisker Growth
33%
Material Science
Activation Energy
5%
Amorphous Material
6%
Annealing
10%
Antimony
13%
Bismuth
7%
Cathode
10%
Cobalt
11%
Corrosion
16%
Corrosion Resistance
7%
Creep
10%
Crystal Structure
8%
Density
37%
Diffusivity
6%
Doping (Additives)
5%
Electrical Resistivity
12%
Electron Backscatter Diffraction
6%
Electronic Circuit
34%
Film
43%
Grain Boundary
17%
Grain Size
8%
Intermetallics
100%
Lead-Free Solder
24%
Mechanical Strength
28%
Microsphere
5%
Microstructural Evolution
11%
Nanocrystalline Material
11%
Nanoparticle
14%
Nanorod
12%
Oxide Compound
14%
Oxide Surface
6%
Residual Stress
10%
Scanning Electron Microscopy
9%
Shear Strength
9%
Shear Testing
16%
Silicon
17%
Sintering
6%
Solder Joint
19%
Stress Analysis
8%
Stress Relaxation
8%
Synchrotron X-Ray Diffraction
9%
Thermal Aging
11%
Thermal Expansion
17%
Thermal Stress
12%
Thermoelectric Materials
26%
Thermoelectrics
34%
Thin Films
46%
Tin
50%
Tin Oxide
17%
X-Ray Diffraction
33%
ZnO
8%
Engineering
Aging Temperature
6%
Alloy Melting
5%
Coefficient of Performance
5%
Concentration Gradient
5%
Corrosion Product
7%
Corrosion Resistance
7%
Creep
5%
Diffusion Barrier
17%
Diffusion Behavior
7%
Dopants
6%
Driving Force
7%
Electroless Nickel
7%
Electromigration
16%
Electronic Packaging
6%
Eutectics
11%
Expansion Coefficient
6%
Experimental Result
9%
Failure Mode
6%
Failure Time
5%
Finite Element Method
8%
Free Solder
17%
Integrated Circuit
8%
Interdiffusion
5%
Intermetallics
56%
Joint Strength
6%
Joints (Structural Components)
39%
Low-Temperature
15%
Melting Point
7%
Melting Temperature
6%
Microstructure
24%
Nanoparticle
11%
Phase Separation
8%
Printed Circuit Board
10%
Ray Diffraction
21%
Reliability Issue
5%
Residual Stress
6%
Shear Strength
11%
Situ Measurement
8%
Solar Cell
6%
Thermal Cycle
5%
Thermal Stress
10%
Thermoelectric Materials
10%
Thermoelectrics
18%
Thin Films
30%
Three Dimensional Integrated Circuits
6%
Underfill
10%
