跳至主導覽
跳至搜尋
跳過主要內容
國立中央大學 首頁
說明與常見問題
English
中文
首頁
人才檔案
研究單位
研究計畫
研究成果
資料集
榮譽/獲獎
學術活動
新聞/媒體
影響
按專業知識、姓名或所屬機構搜尋
查看斯高帕斯 (Scopus) 概要
吳 子嘉
教授, 化學工程與材料工程學系系主任
化學工程與材料工程學系
電子郵件
atwu
ncu.edu
tw
網站
http://www.cme.ncu.edu.tw/products_detail/25.htm
h-index
1145
引文
20
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
2004
2024
每年研究成果
概覽
指紋
網路
研究計畫
(20)
研究成果
(86)
類似的個人檔案
(6)
如果您對這些純文本內容做了任何改變，很快就會看到。
指紋
查看啟用 Tzu-Chia Wu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
Aging of materials
9%
Annealing
12%
Antimony
11%
Atoms
11%
Bismuth
10%
Cobalt
8%
Compressive stress
7%
Corrosion
10%
Crystals
8%
Current density
12%
Diffraction
7%
Diffusion barriers
50%
Electrodes
8%
Electromigration
40%
Electronics packaging
7%
Eutectics
12%
Fluxes
7%
Intermetallics
66%
Lead-free solders
18%
Melting
10%
Melting point
9%
Microspheres
6%
Microstructure
22%
Nanocrystals
12%
Nanorods
15%
Nickel-Phosphorus
7%
Oxide films
9%
Oxides
8%
Phase separation
7%
Photodiodes
8%
Shear strength
8%
Silicon
10%
Soldering alloys
84%
Spalling
13%
Sputtering
7%
Strength of materials
12%
Stress analysis
10%
Substrates
37%
Surface chemistry
33%
Synchrotron radiation
32%
Synchrotrons
34%
Temperature
18%
Thermal aging
10%
Thermal stress
9%
Thin films
29%
Three dimensional integrated circuits
13%
Tin
25%
Tin oxides
15%
X ray diffraction
28%
X rays
27%
Chemical Compounds
Alloy
19%
Annealing
9%
Coating Agent
5%
Current Density
9%
Diffusion
11%
Diffusion Barrier
38%
Electric Effect
5%
Eutectics
12%
Force
6%
Grain Size
6%
Intermetallic Compound
59%
Liquid Film
13%
Melting
8%
Melting Point
7%
Microstructure
21%
Nanocrystal
6%
Nanorod
8%
Oxide
5%
Purity
5%
Residual Stress
6%
Shear
13%
Shear Strength
11%
Simulation
5%
Solder
100%
Strain
12%
Strength
14%
Surface
12%
Surface Chemistry
21%
Synchrotron Radiation
14%
Thermal Aging
11%
Thermal Expansion Coefficient
5%
Thermoelectricity
30%
Tin Oxide
7%
Waste Heat
5%
X-Ray Diffraction
6%
X-Ray Synchrotron Radiation
6%
Physics & Astronomy
annealing
6%
antimony
7%
bismuth tellurides
5%
chips
17%
chlorine
5%
current density
7%
diffraction
12%
electric current
6%
electromigration
38%
eutectics
11%
evaluation
6%
integrated circuits
16%
intermetallics
43%
kinetics
11%
melting
5%
microstructure
12%
modules
9%
nanocrystals
6%
nanorods
6%
nickel
5%
oxides
5%
packaging
6%
photodiodes
6%
shear strength
6%
silicon
5%
solders
66%
strip
5%
submerging
5%
synchrotron radiation
9%
synchrotrons
18%
temperature
5%
thermoelectric materials
18%
thin films
12%
tin
32%
tin oxides
13%
voids
8%
x rays
16%
