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查看斯高帕斯 (Scopus) 概要
吳 子嘉
教授, 工學院副院長
化學工程與材料工程學系
電子郵件
atwu
ncu.edu
tw
網站
http://www.cme.ncu.edu.tw/products_detail/25.htm
h-index
1353
引文
21
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
2004
2024
每年研究成果
概覽
指紋
網路
研究計畫
(25)
研究成果
(93)
類似的個人檔案
(6)
指紋
查看啟用 Tzu-Chia Wu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Keyphrases
Intermetallic Compounds
73%
Soldering
64%
Electromigration
56%
Cu Substrate
36%
Diffusion Barrier
35%
Whisker Growth
33%
Surface Finish
31%
3D IC
31%
Interfacial Reaction
27%
Synchrotron Radiation X-ray
26%
Current Stressing
25%
Thermoelectric Materials
25%
Bismuth Telluride
25%
Microstructure
20%
Electrical Current
18%
Sn Whisker
18%
Whisker
18%
Cu6Sn5
17%
Solder Alloys
17%
Electroless
16%
Pb-free Solder
16%
Amorphous InGaZnO (a-IGZO)
15%
Current Density
15%
Thermoelectric Module
15%
Microbump
15%
Annealing
14%
Kinetic Analysis
14%
Ag3Sn
13%
Tin Whisker
13%
Thermal Stress
13%
Mechanical Strength
13%
Microstructure Evolution
13%
In Situ
13%
Synchrotron X-ray
12%
Ni-Sn
12%
Massive Spalling
12%
Co-based
12%
Solder Joint
12%
Ni3S4
12%
Low Temperature
12%
Grazing Incidence X-ray Diffraction (GIXRD)
11%
High Reliability
11%
In Situ Synchrotron X-ray Diffraction
11%
Electric Current
11%
Co-sputtering
11%
Shear Test
11%
Cu-Sn
10%
Tin Oxide Thin Film
10%
NiTe
10%
Electroless Cobalt
10%
Material Science
Intermetallics
100%
Tin
48%
Surface (Surface Science)
48%
Thin Films
48%
Film
47%
Density
35%
Thermoelectrics
35%
Electronic Circuit
34%
X-Ray Diffraction
32%
Thermoelectric Materials
26%
Lead-Free Solder
24%
Solder Joint
20%
Tin Oxide
17%
Grain Boundaries
17%
Thermal Expansion
17%
Silicon
17%
Corrosion
16%
Shear Testing
16%
Nanoparticle
14%
Antimony
13%
Oxide Compound
13%
Crystal Structure
12%
Thermal Stress
12%
Nanorod
12%
Electrical Resistivity
12%
Phase Composition
12%
Thermal Aging
11%
Strength of Materials
11%
Microstructural Evolution
11%
Annealing
11%
Cobalt
10%
Cathode
10%
Scanning Electron Microscopy
10%
Synchrotron X-Ray Diffraction
9%
Grain Size
9%
Shear Strength
9%
Creep
9%
Residual Stress
8%
Stress Analysis
8%
ZnO
8%
Bismuth
7%
Corrosion Resistance
7%
Electron Backscatter Diffraction
6%
Diffusivity
6%
Sintering
6%
Doping (Additives)
6%
Activation Energy
5%
Stress Relaxation
5%
Microsphere
5%
Chemical Vapor Deposition
5%
Engineering
Intermetallics
56%
Joints (Structural Components)
40%
Thin Films
33%
Ray Diffraction
21%
Thermoelectricity
18%
Diffusion Barrier
17%
Free Solder
17%
Electromigration
16%
Low-Temperature
15%
Melting Point
14%
Nanoparticle
12%
Shear Strength
11%
Printed Circuit Board
10%
Eutectics
10%
Thermoelectric Materials
10%
Underfill
10%
Thermal Stress
10%
Experimental Result
9%
Situ Measurement
8%
Phase Separation
8%
Finite Element Analysis
8%
Integrated Circuit
8%
Silicon Dioxide
8%
Corrosion Product
8%
Corrosion Resistance
8%
Phase Composition
7%
Diffusion Behavior
7%
Driving Force
7%
Electroless Nickel
7%
Growth Kinetics
6%
Electronic Packaging
6%
Joint Strength
6%
Three Dimensional Integrated Circuits
6%
Aging Temperature
6%
Expansion Coefficient
6%
Dopants
6%
Residual Stress
6%
Solar Cell
6%
Failure Mode
6%
Coefficient of Performance
5%
Thermal Cycle
5%
Melting Temperature
5%
Creep
5%
Concentration Gradient
5%
Compressive Stress
5%
Interdiffusion
5%
Reliability Issue
5%
Failure Time
5%
