按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
1996 …2023

每年研究成果

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會議論文篇章

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  • 2022

    Low-Temperature Rough-Surface Wafer Bonding with AlN/AlN Via Oxygen Plasma Activation

    Huang, W. C., Nien, S. M., Ruan, J. L., Kuo, Y. K. & Lee, B. T. H., 2022, ECS Transactions. 1 編輯 Institute of Physics, p. 49-50 2 p. (ECS Transactions; 卷 108, 編號 1).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2018

    Rapid fabricating sub-50 nm FD-SOI: by secondary ion-cut processing

    Lee, B. T. H., Chang, Y. L., Huang, C. H., Ho, C. C., Lo, F. S. & Hwang, Y. R., 2 7月 2018, 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018. Institute of Electrical and Electronics Engineers Inc., 8640210. (2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    1 引文 斯高帕斯(Scopus)
  • 2017

    Free-carrier absorption assisted photoelectrochemistry of silicon

    Lee, B. T. H., Chiang, C. C. & Hwang, Y. R., 2017, ECS Transactions. Abbott, A. P., Alkire, R., Allongue, P., Anderson, T. J., Bartlett, P. N., Bayachou, M., Bhansali, S., Birbilis, N., Bocarsly, A. B., Bock, C., Boltalina, O. V., Brankovic, S., Buchheit, R., Buttry, D. A., Calabrese Barton, S., Carter, M. T., Chaitanya, V., Cheek, G. T., Chen, Z., Chidambaram, D., Chin, B. A., Choi, J. W., Chu, D., Cliffel, D. E., Deligianni, H., Di Noto, V., Dimitrov, N., Doeff, M., Douglas, E. A., Druffel, T., Edstrom, K., Fenton, J. M., Fergus, J., Fransaer, J., Fukunaka, Y., Guyomard, D., Hamada, H., Haverhals, L. M., Hesketh, P., Hillier, A. C., Hite, J. K., Imahori, H., Inaba, M., Innocenti, M., Itagaki, M., Johnson, C., Katayama, H., Kilgore, S. H., Kim, D. J., Koehne, J., Kostecki, R., Krumdick, G., Kulesza, P. J., Leddy, J., Lee, J. J., Leonte, O., Lu, Y. C., Lucht, B. L., Lynch, R. P., Manivannan, M., Mantz, R. A., Marcus, P., Maurice, V., Mauter, M., Mauzeroll, J., McMurray, H. N., Meng, Y. S., Miller, E. L., Milosev, I., Minteer, S. D., Mitra, S., Mukerjee, S., Mukundan, R., Muldoon, J., Nagahara, L., Narayan, S. R., Natishan, P. M., Navaei, M., Nicholas, J. D., Noel, J., Nonnenmann, S. S., O'Dwyer, C., Orazem, M. E., Oren, Y., Park, J. G., Pharkya, P., Pintauro, P. N., Pylypenko, S., Rajeshwar, K., Ramasamy, R. P., Rhodes, C., Riemer, D. P., Roeper, D., Rohwerder, M., Romankiw, L., Rotkin, S. V., Rupp, J. L. M., Sailor, M. J., Schwartz, D. T., Sekhar, P. K., Sharma, N., Simonian, A., Smith, D. K., Smith, K. C., Soleymani, L., Stafford, G. R., Staser, J. A., Subramanian, V., Subramanian, V. R., Sundaram, K. B., Suroviec, A. H., Suto, K., Tao, M., Tatsuma, T., Trulove, P. C., Vanysek, P., Vasiljevic, N., Vaughey, J. T., Virtanen, S., Wang, H., Wang, W., Whitacre, J. F., Williams, G., Winter, M., Wood, D. L., Wu, G., Wu, N., Xiao, J., Xing, Y., Xu, H., Yang, J. J. & Zangari, G. (編輯). 10 編輯 Electrochemical Society Inc., p. 1113-1125 13 p. (ECS Transactions; 卷 80, 編號 10).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • Measurement of thickness of high-resistivity substrate by photoconduction enhanced capacitance displacement sensor

    Lee, B. T. H. & Lin, M. C., 2017, Selected Proceedings from the 231st ECS Meeting New Orleans, LA - Spring 2017. 11 編輯 Electrochemical Society Inc., p. 1747-1752 6 p. (ECS Transactions; 卷 77, 編號 11).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2015

    The suppression effect of 830 nm laser irradiation on porous silicon formation

    Chiang, C. C., Huang, Y. C., Juan, P. C., Lo, F. S. & Lee, T. H., 2015, Nanoscale Electrochemistry. Ito, T. & Kusoglu, A. (編輯). 35 編輯 Electrochemical Society Inc., p. 1-7 7 p. (ECS Transactions; 卷 69, 編號 35).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2014

    Enhancement of bonding strength for low temperature Si3N4/Si3N4 direct wafer bonding by nitrogen-plasma activation and hydrofluoric pre-dip

    Lo, F. S., Chiang, C. C., Li, C. & Lee, T. H., 2014, Semiconductor Wafer Bonding 13: Science, Technology, and Applications. Suga, T., Goorsky, M. S., Knechtel, R., Moriceau, H., Baumgart, H., Tan, C. S. & Hobart, K. D. (編輯). 5 編輯 Electrochemical Society Inc., p. 111-117 7 p. (ECS Transactions; 卷 64, 編號 5).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2006

    Layer transfer of hydrogen-implanted silicon wafers by thermal-microwave co-activation

    Yang, Y. Y., Huang, C. H., Hsu, Y. K., Jeng, S. J., Tai, C. C., Lee, S., Chen, H. W., Gan, Q., Chu, C. S., Ting, J. H., Lai, C. S. & Lee, T. H., 2006, Transistor Scaling-Methods, Materials and Modeling. Materials Research Society, p. 111-116 6 p. (Materials Research Society Symposium Proceedings; 卷 913).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • Nanothick layer transfer of hydrogen-implanted wafer using polysilicon sacrificial layer

    Huang, C. H., Chang, C. L., Yang, Y. Y., Suryasindhu, T., Liao, W. C., Su, Y. H., Li, P. W., Liu, C. Y., Lai, C. S., Ting, J. H., Chu, C. S., Lee, C. S. & Lee, T. H., 2006, Nanomanufacturing. Materials Research Society, p. 84-89 6 p. (Materials Research Society Symposium Proceedings; 卷 921).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審