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查看斯高帕斯 (Scopus) 概要
李 天錫
教授
機械工程學系
電子郵件
benlee
ncu.edu
tw
網站
https://www.me.ncu.edu.tw/Faculty/faculty-more.php?id=40
h-index
892
引文
14
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1996 …
2023
每年研究成果
概覽
指紋
網路
研究計畫
(15)
研究成果
(50)
類似的個人檔案
(6)
如果您對這些純文本內容做了任何改變，很快就會看到。
指紋
查看啟用 Tien-Hsi Lee 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
Wafer bonding
100%
Silicon
83%
Hydrogen
58%
Porous silicon
47%
Ions
46%
Silicon wafers
44%
Annealing
40%
Plasmas
39%
Laser beam effects
37%
Temperature
37%
Nanocrystals
32%
Chemical activation
27%
Nitrogen plasma
26%
Substrates
26%
Fabrication
25%
Microwaves
24%
Polysilicon
21%
Crystalline materials
20%
Lasers
20%
Silicon oxides
20%
Electrochemistry
20%
Photoluminescence
18%
Sputtering
18%
Thin films
17%
Thickness measurement
16%
Oxidation
16%
Oxides
16%
Glass
16%
Electrochemical etching
15%
Etching
15%
Ion implantation
13%
Hot Temperature
13%
Semiconductor materials
13%
Transmission electron microscopy
13%
Anodic oxidation
12%
Ammonium hydroxide
12%
Copper
11%
Solid oxide fuel cells (SOFC)
11%
Sensors
11%
Hybrid sensors
11%
Infrared lasers
11%
Chemical mechanical polishing
11%
Nanogenerators
10%
Composite films
10%
Hybrid materials
10%
Germanium
9%
Polymethyl methacrylates
9%
Surface chemistry
9%
Epitaxial growth
9%
Electrolytes
9%
Chemical Compounds
Annealing
33%
Surface
32%
Energy
28%
Etching
25%
Hydrogen
25%
Nonconductor
21%
Polishing
20%
Anodizing
17%
Photoluminescence
16%
Plasma
16%
Semiconductor
16%
Porosity
14%
Implant
13%
Nanocrystal
13%
Electrochemistry
13%
Microelectronics
13%
Ion
13%
Vacuum
12%
Energy Consumption
12%
Microwave
11%
Epitaxial Growth
11%
Silicon Oxide
10%
Application
10%
Voltage
10%
Pressure Sensor
10%
Alloy
10%
Glass
10%
Oxide
9%
Ammonium Hydroxide
8%
Sputtering
7%
Nanomaterial
7%
Short Circuit
7%
Nitrogen
7%
Time
7%
Ion Implantation
7%
Plasma Enhanced Chemical Vapour Deposition
7%
Interfacial Energy
7%
Fracture Strength
7%
Nanoporosity
6%
Strength
6%
Surface Chemistry
6%
Optoelectronics
6%
Wavelength
6%
Quartz
6%
Transmission Electron Microscopy
6%
Displacement
5%
Fiber
5%
Boron Atom
5%
Implanted Ion
5%
Crack Propagation
5%
Physics & Astronomy
wafers
56%
silicon
36%
hydrogen
33%
blisters
16%
insulators
15%
hydrogen ions
14%
ions
12%
sputtering
11%
implantation
10%
direct power generators
10%
low vacuum
10%
thin films
10%
patents
9%
thermionics
9%
annealing
8%
hydroxides
8%
quartz
7%
damage
7%
energy
7%
microwaves
6%
silicon oxides
6%
space charge
6%
etching
6%
diamonds
5%
activation
5%
activation energy
5%
oxidation
5%
sensors
5%
temperature
5%
high temperature air
5%
output
5%
