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查看斯高帕斯 (Scopus) 概要
李 勝隆
教授
材料科學與工程研究所
電子郵件
shenglon
cc.ncu.edu
tw
網站
https://www.me.ncu.edu.tw/Faculty/faculty-more.php?id=9
h-index
2688
引文
29
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1986 …
2024
每年研究成果
概覽
指紋
網路
研究計畫
(17)
研究成果
(134)
資料集
(6)
類似的個人檔案
(6)
指紋
查看啟用 Sheng-Long Lee 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Material Science
Alloying
7%
Aluminum
27%
Aluminum Alloy
44%
Annealing
10%
Beryllium
10%
Carbon Dioxide
13%
Carbon Nanotube
7%
Composite Material
54%
Copper Alloy
10%
Corrosion
58%
Corrosion Resistance
36%
Dehydrogenation
11%
Density
15%
Desorption
14%
Differential Scanning Calorimetry
12%
Electrical Conductivity
11%
Electrical Resistivity
8%
Film
37%
Fracture Toughness
14%
Grain Boundary
8%
Grain Size
10%
Graphene
10%
Heat Treatment
58%
Homogenization
11%
Hot Pressing
11%
Hydride
13%
Hydrogen Storage Alloys
8%
Intermetallics
22%
Magnesium Alloys
15%
Matrix Composite
29%
Metal-Organic Framework
10%
Nucleation
8%
Oxide Compound
9%
Scandium
10%
Scanning Electron Microscopy
12%
Silicon
50%
Solid Solutions
8%
Stress Corrosion Cracking
17%
Surface (Surface Science)
19%
Tensile Property
16%
Thermal Conductivity
7%
Thermal Expansion
8%
Thermal Stability
23%
Thin Films
16%
Titanium Dioxide
10%
Ultimate Tensile Strength
47%
Volume Fraction
15%
Work Hardening
13%
X-Ray Diffraction
22%
ZnO
17%
Keyphrases
3.5% NaCl Solution
16%
A356
12%
A356 Alloy
17%
A357 Alloy
20%
Acicular
11%
Al-7Si
12%
Al-7Si Alloy
20%
Al-Mg Alloy
10%
Al-Sc
19%
Al-Zn-Mg-Cu
13%
Aluminum Alloy
23%
Annealing
15%
Cast Alloy
11%
Channel Extrusion
15%
Cold Working
11%
Copper Matrix Composites
24%
Corrosion Behavior
31%
Corrosion Properties
24%
Corrosion Resistance
35%
Corrosive Wear
13%
Cross-channel
15%
Ductility
11%
Electrical Conductivity
20%
Fe Content
14%
Graphite
11%
Heat Treatment
25%
Heat Treatment Effect
13%
Hot Pressing
11%
Hydrogen Storage Properties
11%
Iron Phases
16%
LiAlH4
10%
Mechanical Properties
100%
Mg2Si
10%
Microstructure
27%
Microstructure Properties
61%
N-Si
10%
NaCl Solution
10%
Recrystallization
10%
Reinforced
20%
Scandium Oxide
11%
Si(111)
10%
SiCp
17%
Silicon Particles
15%
Stress Corrosion Cracking
10%
Stress Corrosion Resistance
10%
Tensile Properties
12%
Tensile Strength
22%
Thermal Stability
16%
Wear Behavior
21%
X Ray Diffraction
13%
Engineering
Al Matrix
6%
Automotives
11%
Casting Alloy
6%
Casting Process
9%
Cold Working
10%
Complex Potential
6%
Corrosion Behavior
18%
Corrosion Property
17%
Corrosion Resistance
33%
Crack Tip
7%
Deformation Processing
8%
Device Wafer
6%
Discharge Capacity
6%
Dispersoid
11%
Elastic Interaction
6%
Electrical Conductivity
13%
Electroless Nickel
6%
Energy Band Diagram
6%
Eutectics
19%
Experimental Result
8%
Extrusion Process
12%
Fe Content
18%
Growth Temperature
6%
Heat Treatment
39%
Hot Pressing
11%
Hydrogen Storage
20%
Hypoeutectic Alloy
12%
Interfacial Crack
8%
Intermetallics
13%
Internal Crack
6%
Iron
26%
Isothermal
10%
Martensite
7%
Mass Production
6%
Melting Point
9%
Mg-Mn Alloy
6%
Ni Alloy
6%
Ray Diffraction
13%
Recrystallized Grain
8%
Rich Phase
7%
Screw Dislocation
9%
Silicon Particle
14%
Strain Hardening
13%
Stress Corrosion Cracking
13%
Stress Field
7%
Stress-Intensity Factor
10%
Tensile Property
9%
Thin Films
12%
Ultimate Tensile Strength
34%
Yield Point
6%
