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電磁相容,信號與電源完整度,巨觀建模,數值分析
指紋
查看啟用 Chiu-Chih Chou 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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An Embedded Common-Mode Filter and Mixed-Mode Scattering Parameters for the MIPI C-PHY Interface
Chien, Y. C., Liu, H. W., Chou, C. C. & Wu, T. L., 1 2月 2024, 於: IEEE Transactions on Electromagnetic Compatibility. 66, 1, p. 143-152 10 p.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
1 引文 斯高帕斯(Scopus) -
Causality Assessment of Channels with Long Delay
Wang, C. Y. & Chou, C. C., 2024, 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 400-403 4 p. (2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
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Comparison of S-Parameter Low Frequency Interpolation Methods
Huang, C. C., Wang, C. Y. & Chou, C. C., 2024, 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 574-577 4 p. (2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審
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Estimation of Reference Impedance in 2x-thru De-embedding With High Conductor-Loss Lines
Chou, C. C., 2024, 於: IEEE Transactions on Electromagnetic Compatibility. 66, 5, p. 1315-1328 14 p.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
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Reassessing the FER3 of the IEEE 370 Standard
Chou, C. C., 2024, 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc., p. 478 1 p. (IEEE International Symposium on Electromagnetic Compatibility).研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審