按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
1996 …2024

每年研究成果

篩選
會議論文篇章

搜尋結果

  • 2009

    Cross-interaction effect in the Ni/Sn/Cu solder joints

    Tseng, H. W., Wang, S. J. & Liu, C. Y., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 325-330 6 p. 5416529. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    1 引文 斯高帕斯(Scopus)
  • Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces

    Tseng, H. W., Lu, C. T., Hsiao, Y. H., Liao, P. L., Chuang, Y. C. & Liu, C. Y., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 401-405 5 p. 5416515. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    2 引文 斯高帕斯(Scopus)
  • 2008

    Copper/carbon nanotube composite interconnect for enhanced electromigration resistance

    Chai, Y., Chan, P. C. H., Fu, Y., Chuang, Y. C. & Liu, C. Y., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 412-420 9 p. 4550004. (Proceedings - Electronic Components and Technology Conference).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    41 引文 斯高帕斯(Scopus)
  • 2007

    Studies and issues of thin-GaN LED process

    Chen, P. H., Lin, C. L., Lin, Y. H., Chou, P. K. & Liu, C. Y., 2007, Seventh International Conference on Solid State Lighting. 66690V. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6669).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2006

    Current density dependence of EM (electromigration)-induced flip-chip Cu pad consumption

    Liao, P. L. & Liu, C. Y., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430690. (2006 International Conference on Electronic Materials and Packaging, EMAP).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • Nanothick layer transfer of hydrogen-implanted wafer using polysilicon sacrificial layer

    Huang, C. H., Chang, C. L., Yang, Y. Y., Suryasindhu, T., Liao, W. C., Su, Y. H., Li, P. W., Liu, C. Y., Lai, C. S., Ting, J. H., Chu, C. S., Lee, C. S. & Lee, T. H., 2006, Nanomanufacturing. Materials Research Society, p. 84-89 6 p. (Materials Research Society Symposium Proceedings; 卷 921).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • Study of interfacial reactions by Ni/Sn5Ag/Cu sandwich structure

    Tseng, H. W. & Liu, C. Y., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430691. (2006 International Conference on Electronic Materials and Packaging, EMAP).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2005

    Electromigration studies on Sn(Cu) alloy lines

    Lu, C. C., Wang, S. J. & Liu, C. Y., 2005, Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces. p. 54-59 6 p. 1432045. (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces; 卷 2005).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

  • 2003

    Metallic wafer and chip bonding for LED packaging

    Hsu, C. C., Wang, S. J. & Liu, C. Y., 2003, CLEO/Pacific Rim 2003 - 5th Pacific Rim Conference on Lasers and Electro-Optics: Photonics Lights Innovation, from Nano-Structures and Devices to Systems and Networks, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 26 1 p. 1274506. (Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest; 卷 1).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審

    11 引文 斯高帕斯(Scopus)
  • 2002

    Spalling suppression by Sn-3.5Ag incorporated with Cu particles

    Liu, C. Y. & Wang, S. J., 2002, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 366-371 6 p. 1188866. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

    研究成果: 書貢獻/報告類型會議論文篇章同行評審