Cheng-Yi Liu

2023

Low-temperature PECVD silicon-nitride passivation for perovskite solar cell

Lai, T. L., Lee, Y. F., Hsu, Y. H., Tsai, C. P., Huang, C. K. & Liu, C. Y., 15 1月 2023, 於: Materials Chemistry and Physics. 294, 126880.

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2022

Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step

Huang, B. R., Yeh, C. Y., Hsu, Y. H., Tsai, C. P., Lee, Y. F., Wang, J. Y. & Liu, C. Y., 2022, (已被接受) 於: JOM.

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1 引文斯高帕斯（Scopus）

Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface

Yeh, C. Y., Wang, J. Y., Wu, C. Y., Chiu, C. Y., Lee, C. H., Huang, B. R., Fu, K. L., Chang, J. S., Yen, T. H., Lee, Y. F. & Liu, C. Y., 12月 2022, 於: Journal of Materials Science: Materials in Electronics. 33, 34, p. 25580-25588 9 p.

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Flexible multijunction solar cells embedded inside smart dust modules for outdoor applications to Smart Grids

Liu, C. Y., Huang, C. K., Huang, Y. Y., Chang, K. C., Yu, K. L., Chiang, C. H., Wu, C. G., Lee, S. C., Yen, W. Y., Sheu, J. K. & Shi, J. W., 15 1月 2022, 於: Applied Energy. 306, 117970.

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1 引文斯高帕斯（Scopus）

High-Brightness, High-Speed, and Low-Noise VCSEL Arrays for Optical Wireless Communication

Khan, Z., Chang, Y. H., Pan, T. L., Zhao, Y. C., Huang, Y. Y., Lee, C. H., Chang, J. S., Liu, C. Y., Lee, C. Y., Fang, C. Y. & Shi, J. W., 2022, 於: IEEE Access. 10, p. 2303-2317 15 p.

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6 引文斯高帕斯（Scopus）

Low-Noise, Single-Polarized, and High-Speed Vertical-Cavity Surface-Emitting Lasers for Very Short Reach Data Communication

Huang, Y. YU., Chang, Y. H., Zhao, Y. C., Khan, Z., Ahmad, Z., Lee, C. H., Chang, J. S., Liu, C. Y. & Shi, J-W., 2022, (已被接受) 於: Journal of Lightwave Technology.

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1 引文斯高帕斯（Scopus）

Mechanism and quantum efficiency of yellow emission at the organic-inorganic F8T2/p-GaN interface

Chou, C. Y., Lin, C. H., Liao, C. H., Wu, Y. J., Chen, W. H., Li, B. J. & Liu, C. Y., 4月 2022, 於: Surfaces and Interfaces. 29, 101799.

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Wet-etching mechanism of a semi-sphere pattern on sapphire substrate

Liu, C. Y., Yeh, C. Y., Lai, W. H., Chou, C. Y., Li, X. F., Cheng, C., Huang, C. K. & Lai, T. L., 1 4月 2022, 於: Materials Chemistry and Physics. 281, 125863.

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2 引文斯高帕斯（Scopus）

2021

Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure

Chen, W. H., Chou, C. Y., Li, B. J., Yeh, C. Y., Huang, B. R., Hsu, M. F., Chung, S. F. & Liu, C. Y., 3月 2021, 於: Journal of Electronic Materials. 50, 3, p. 779-785 7 p.

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5 引文斯高帕斯（Scopus）

Controlling the Electron Concentration for Surface-Enhanced Raman Spectroscopy

Nguyen, T. A. N., Yu, Y. L., Chang, Y. C., Wang, Y. H., Woon, W. Y., Wu, C. T., Lin, K. L., Liu, C. Y., Chien, F. C. & Lai, K. Y., 18 8月 2021, 於: ACS Photonics. 8, 8, p. 2410-2416 7 p.

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1 引文斯高帕斯（Scopus）

Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration

Lin, Y. X., Wang, J. Y., Chen, C. Y., Wu, C. Y., Chiu, C. Y., Lee, C. H., Yeh, C. Y., Huang, B. R., Chang, J. S., Yen, T. H., Fu, K. L. & Liu, C. Y., 12月 2021, 於: Journal of Electronic Materials. 50, 12, p. 6584-6589 6 p.

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Effect of Ag solutes on the solid-state Cu dissolution in the Sn3.5Ag

Wang, J. Y., Lin, Y. X., Yeh, C. Y., Chiu, C. Y., Lin, E. J., Wu, C. Y., Lee, C. H., Chang, P. J. & Liu, C. Y., 1月 2021, 於: Journal of Materials Science: Materials in Electronics. 32, 1, p. 567-576 10 p.

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3 引文斯高帕斯（Scopus）

Effect of de-twinning on tensile strength of nano-twinned cu films

Lee, C. H., Lin, E. J., Wang, J. Y., Lin, Y. X., Wu, C. Y., Chiu, C. Y., Yeh, C. Y., Huang, B. R., Fu, K. L. & Liu, C. Y., 7月 2021, 於: Nanomaterials. 11, 7, 1630.

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2 引文斯高帕斯（Scopus）

Effect of mixing glass frits on electrical property and microstructure of sintered Cu conductive thick film

Wang, J. Y., Lin, Y. X., Wu, C. Y., Chiu, C. Y., Lee, C. H., Yeh, C. Y., Huang, B. R. & Liu, C. Y., 4月 2021, 於: Journal of the American Ceramic Society. 104, 4, p. 1707-1715 9 p.

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4 引文斯高帕斯（Scopus）

Flip-Chip Packaged Perovskite Solar Cells

Huang, C. K., Chiu, C. Y., Lai, T. L., Cheng, C., Lai, W. H., Chang, P. J., Wu, J. L., Chiang, C. H., Wu, C. G. & Liu, C. Y., 7月 2021, 於: Energy Technology. 9, 7, 2001129.

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1 引文斯高帕斯（Scopus）

High-mobility ZnV_xO_y/ZnO conduction path in ZnO/V/ZnO multilayer structure

Li, B. J., Wei, Y. S., Liao, C. H., Chen, W. H., Chou, C. Y., Cheng, C. & Liu, C. Y., 21 8月 2021, 於: Journal of Applied Physics. 130, 7, 075302.

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

Measurement of internal electrical field across InGaN quantum wells in GaN LEDs

Huang, C. K., Cheng, C., Lai, W. H., Chung, C. C., Chang, P. J. & Liu, C. Y., 1 6月 2021, 於: Materials Chemistry and Physics. 265, 124514.

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Morphological effect of patterned sapphire substrate on efficiency of white-light phosphor LED package

Chou, C. Y., Lai, W. H., Li, X. F., Cheng, C., Huang, C. K. & Liu, C. Y., 9月 2021, 於: Optical Materials. 119, 111297.

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1 引文斯高帕斯（Scopus）

Nanostructured InGaN Quantum Wells as a Surface-Enhanced Raman Scattering Substrate with Expanded Hot Spots

Chien, F. C., Zhang, T. F., Chen, C., Nguyen, T. A. N., Wang, S. Y., Lai, S. M., Lin, C. H., Huang, C. K., Liu, C. Y. & Lai, K. Y., 26 3月 2021, 於: ACS Applied Nano Materials. 4, 3, p. 2614-2620 7 p.

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2 引文斯高帕斯（Scopus）

Pd/Cu(220) interdiffusion under compressive stress

Liu, C. Y., Chiu, C. Y., Lin, E. J., Chang, P. J., Tang, Y. K. & Yang, K. H., 1 10月 2021, 於: Materials Chemistry and Physics. 271, 124882.

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Plastic deformation of ZnO thin films through edge and screw dislocation movements

Chen, W. H., Chou, C. Y., Li, B. J., Cheng, S. L. & Liu, C. Y., 12月 2021, 於: Journal of the American Ceramic Society. 104, 12, p. 6579-6588 10 p.

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Study of galvanized Sn-finished Ag surface

Wu, C. Y., Fu, K. L., Lin, Y. X., Wang, J. Y., Lee, C. H., Chiu, C. Y., Yeh, C. Y., Huang, B. R., Chang, J. S. & Liu, C. Y., 7月 2021, 於: Journal of Materials Science: Materials in Electronics. 32, 14, p. 18605-18615 11 p.

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2020

Effect of annealing atmosphere (CO and N₂ gas flow) on surface morphology and crystal quality of AlN buffer layer

Cheng, C., Lai, W. H., Huang, C. K. & Liu, C. Y., 1 6月 2020, 於: Ceramics International. 46, 8, p. 11080-11088 9 p.

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3 引文斯高帕斯（Scopus）

Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)

Wu, C. Y., Chen, Y. H., Tang, Y. K., Lin, E. J., Lin, Y. X., Wang, J. Y., Zhuang, W. X., Lee, C. H., Chiu, C. Y., Yeh, C. Y., Hsiao, C. Y., Cheng, M. L., Liu, A. L. & Liu, C. Y., 1 1月 2020, 於: Journal of Electronic Materials. 49, 1, p. 26-33 8 p.

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1 引文斯高帕斯（Scopus）

Effect of eutectic reaction between depositing atoms and substrate elements on morphological evolution of Sn–Bi–Sn multilayer deposition

Tang, Y. K., Lin, E. J., Wang, J. Y., Lin, Y. X., Wu, C. Y., Chiu, C. Y., Lee, C. H., Wang, C. P. & Liu, C. Y., 1 8月 2020, 於: Materials Chemistry and Physics. 250, 122960.

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1 引文斯高帕斯（Scopus）

Formation Mechanism of Self-Formed Triangular Pyramidal Patterns on Sapphire Substrate

Lai, W. H., Huang, S. W., Chen, Y. H., Cheng, C. & Liu, C. Y., 1 7月 2020, 於: Crystal Growth and Design. 20, 7, p. 4811-4817 7 p.

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3 引文斯高帕斯（Scopus）

High-dielectric-constant silicon nitride thin films fabricated by radio frequency sputtering in Ar and Ar/N₂ gas mixture

Chou, C. Y., Lin, C. H., Chen, W. H., Li, B. J. & Liu, C. Y., 1 9月 2020, 於: Thin Solid Films. 709, 138198.

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6 引文斯高帕斯（Scopus）

High-power and single-mode VCSEL arrays with single-polarized outputs by using package-induced tensile strain

Shi, J. W., Khan, Z., Horng, R. H., Yeh, H. Y., Huang, C. K., Liu, C. Y., Shih, J. C., Chang, Y. H., Yen, J. L. & Sheu, J. K., 1 9月 2020, 於: Optics Letters. 45, 17, p. 4839-4842 4 p.

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7 引文斯高帕斯（Scopus）

Research on a Novel GaN-Based Converted Mini-LED Backlight Module via a Spectrum-Decouple System

Huang, C. H., Chang, S. H., Liaw, B. Y., Liu, C. Y., Chou, C. Y., Zhou, J. R., Lin, C. C., Kuo, H. C., Song, L. J., Li, F. & Liu, X., 2020, 於: IEEE Access. 8, p. 138823-138833 11 p., 9143121.

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7 引文斯高帕斯（Scopus）

2019

Experiment and Theoretical Calculation of the Surface Space Charge Region Effect on Photocurrent Generation of SnO ₂ Bilayer Photodiode Devices

Liao, C. H., Lee, P. M., Lin, C. H., Chen, W. H., Chou, C. Y., Wu, Y. J. & Liu, C. Y., 4月 2019, 於: Advanced Electronic Materials. 5, 4, 1800679.

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1 引文斯高帕斯（Scopus）

Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED

Chang, P. J., Tang, Y. K., Lai, W. H., Chiang, A. S. T. & Liu, C. Y., 15 1月 2019, 於: Journal of Electronic Materials. 48, 1, p. 194-200 7 p.

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2 引文斯高帕斯（Scopus）

Fabrication of p-type TiO₂ and transparent p-TiO₂/n-ITO p-n junctions

Lin, C. H., Liao, C. H., Chen, W. H., Chou, C. Y. & Liu, C. Y., 1 4月 2019, 於: AIP Advances. 9, 4, 045229.

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1 引文斯高帕斯（Scopus）

Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys

Wang, J. Y., Tang, Y. K., Yeh, C. Y., Chang, P. J., Lin, Y. X., Lin, E. J., Wu, C. Y., Zhuang, W. X. & Liu, C. Y., 15 8月 2019, 於: Journal of Alloys and Compounds. 797, p. 684-691 8 p.

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15 引文斯高帕斯（Scopus）

2018

Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems

Tang, Y. K., Lin, E. J., Wang, J. Y., Lin, Y. S., Hu, Y. J., Hsu, Y. C. & Liu, C. Y., 1 1月 2018, 於: Journal of Electronic Materials. 47, 1, p. 77-83 7 p.

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1 引文斯高帕斯（Scopus）

Fully Solution-Processed Low-Voltage Driven Transparent Oxide Thin Film Transistors

Yang, B. X., Chien, Y. H. C., Chang, T., Liao, C. H., Liu, C. Y., Chiang, A. S. T. & Liu, C. L., 19 12月 2018, 於: Physica Status Solidi (A) Applications and Materials Science. 215, 24, 1800192.

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9 引文斯高帕斯（Scopus）

Mechanism of Ag sulfurization resistance improvement by alloying solutes in Ag-based alloy films

Chen, Y. H., Lin, E. J., Liao, C. H. & Liu, C. Y., 28 6月 2018, 於: Journal of Applied Physics. 123, 24, 245305.

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2 引文斯高帕斯（Scopus）

Photocurrent generation in SnO ₂ thin film by surface charged chemisorption O ions

Lee, P. M., Liao, C. H., Lin, C. H. & Liu, C. Y., 1 6月 2018, 於: Applied Surface Science. 442, p. 398-402 5 p.

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7 引文斯高帕斯（Scopus）

p-type conductive NiO_x: Cu thin films with high carrier mobility deposited by ion beam assisted deposition

Sun, H., Chen, S. C., Chen, P. J., Ou, S. L., Liu, C. Y. & Xin, Y. Q., 2018, 於: Ceramics International. 44, 3, p. 3291-3296 6 p.

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17 引文斯高帕斯（Scopus）

2017

Effect of Cu solubility on electromigration in Sn(Cu) micro joint

Lin, E. J., Tang, Y. K., Hsu, Y. C., Tseng, H. W. & Liu, C. Y., 7 9月 2017, 於: Journal of Applied Physics. 122, 9, 095702.

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8 引文斯高帕斯（Scopus）

Effect of interfacial dissolution on electromigration failures at metals interface

Lin, E. J., Hsu, Y. C., Chuang, Y. C. & Liu, C. Y., 1 10月 2017, 於: Journal of Materials Science: Materials in Electronics. 28, 20, p. 15149-15153 5 p.

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1 引文斯高帕斯（Scopus）

Fabrication of nano-cavity patterned sapphire substrate using self-assembly meshed Pt thin film on c-plane sapphire substrate

Huang, S. W., Chang, C. C., Lin, H. Y., Li, X. F., Lin, Y. C. & Liu, C. Y., 30 4月 2017, 於: Thin Solid Films. 628, p. 127-131 5 p.

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13 引文斯高帕斯（Scopus）

Growth Direction Control of ZnO Nanorods on the Edge of Patterned Indium-Tin Oxide/Aluminum-Doped Zinc Oxide Bilayers

Liao, C. H., Wu, Y. J., Lee, P. M., Lin, C. H., Chen, S. C., Cheng, S. L. & Liu, C. Y., 7 6月 2017, 於: Crystal Growth and Design. 17, 6, p. 3100-3106 7 p.

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2 引文斯高帕斯（Scopus）

Organic/inorganic F8T2/GaN light emitting heterojunction

Wu, Y. J., Liao, C. H., Lee, P. M., Liu, Y. S., Liu, C. L. & Liu, C. Y., 10月 2017, 於: Organic Electronics. 49, p. 64-68 5 p.

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5 引文斯高帕斯（Scopus）

2016

Anelasticity of GaN Epitaxial Layer in GaN LED

Chung, C. C., Yang, C. T. & Liu, C. Y., 10月 2016, 於: Materials Research Express. 3, 10, 105026.

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3 引文斯高帕斯（Scopus）

Effects of nighttime lights by LED and fluorescent lighting on human melatonin

Lu, C. C., Chou, C., Yasukouchi, A., Kozaki, T. & Liu, C. Y., 1 12月 2016, 於: Journal of Ambient Intelligence and Humanized Computing. 7, 6, p. 837-844 8 p.

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3 引文斯高帕斯（Scopus）

Experimental Observation and Computer Simulation of Al/Sn Substitution in p-Type Aluminum Nitride-Doped Tin Oxide Thin Film

Lee, P. M., Liu, Y. S., Villamagua, L., Stashans, A., Carini, M. & Liu, C. Y., 3 3月 2016, 於: Journal of Physical Chemistry C. 120, 8, p. 4211-4218 8 p.

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33 引文斯高帕斯（Scopus）

LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System

Tang, Y. K., Hsu, Y. C., Lin, E. J., Hu, Y. J. & Liu, C. Y., 1 12月 2016, 於: Journal of Electronic Materials. 45, 12, p. 6171-6176 6 p.

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1 引文斯高帕斯（Scopus）

Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates

Liu, C. Y., Wei, Y. S., Lin, E. J., Hsu, Y. C. & Tang, Y. K., 1 12月 2016, 於: Journal of Electronic Materials. 45, 12, p. 6079-6085 7 p.

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The Efficiency and Reliability Improvement by Utilizing Quartz Airtight Packaging of UVC LEDs

Lu, C. C., Wang, C. P., Liu, C. Y. & Hsu, C. P., 2016, 於: IEEE Transactions on Electron Devices. 63, 8, p. 3143-3146 4 p., 7501548.

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17 引文斯高帕斯（Scopus）

2015

Change in the electrical conductivity of SnO₂ crystal from n-type to p-type conductivity

Villamagua, L., Stashans, A., Lee, P. M., Liu, Y. S., Liu, C. Y. & Carini, M., 1 5月 2015, 於: Chemical Physics. 452, p. 71-77 7 p.

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22 引文斯高帕斯（Scopus）

劉 正毓

研究成果

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劉正毓