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查看斯高帕斯 (Scopus) 概要
劉 正毓
教授
化學工程與材料工程學系
光電科學研究中心
電子郵件
chengyi
cc.ncu.edu
tw
網站
http://www.cme.ncu.edu.tw/products_detail/29.htm
h-index
2982
引文
29
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(SciVal)引文計算。
1996 …
2024
每年研究成果
概覽
指紋
網路
研究計畫
(27)
研究成果
(167)
類似的個人檔案
(6)
如果您對這些純文本內容做了任何改變,很快就會看到。
指紋
查看啟用 Cheng-Yi Liu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
Activation energy
7%
Aging of materials
6%
Aluminum nitride
5%
Annealing
15%
Atoms
15%
Cathodes
8%
Compressive stress
5%
Crystals
6%
Current density
8%
Dissolution
17%
Doping (additives)
6%
Electric potential
6%
Electromigration
42%
Electrons
6%
Epitaxial films
6%
Etching
7%
Eutectics
13%
Fabrication
15%
Fluxes
8%
Hot Temperature
6%
Indium
7%
Intermetallics
10%
Light emitting diodes
68%
Metal foil
9%
Metallizing
10%
Metals
5%
Microstructure
9%
Molten materials
13%
Nanorods
9%
Optical waveguides
6%
Oxide films
13%
Oxides
6%
Packaging
5%
Photocurrents
6%
Quantum efficiency
6%
Raman scattering
5%
Sandwich structures
9%
Sapphire
30%
Semiconductor quantum wells
10%
Soldering alloys
72%
Spalling
14%
Substrates
47%
Surface chemistry
22%
Temperature
10%
Thin films
31%
Tin oxides
9%
Wafer bonding
15%
Wet etching
5%
Wetting
11%
Zinc oxide
5%
Physics & Astronomy
activation energy
5%
annealing
10%
anodes
5%
atoms
6%
augmentation
8%
barrier layers
7%
cathodes
6%
chips
30%
conduction
10%
current density
7%
dissolving
12%
drying
6%
electromigration
48%
eutectics
18%
fabrication
13%
foils
6%
intermetallics
8%
ITO (semiconductors)
6%
light emitting diodes
45%
low resistance
5%
microstructure
7%
nanorods
6%
output
6%
oxides
9%
p-n junctions
5%
photoelectron spectroscopy
5%
sandwich structures
9%
sapphire
13%
solders
87%
solutes
5%
spalling
15%
submerging
5%
substitutes
7%
thermomigration
5%
thin films
22%
tin oxides
6%
transmittance
6%
voids
11%
wafers
14%
wetting
13%
Chemical Compounds
Additive
5%
Alloy
9%
Annealing
12%
Cathode
7%
Contact Resistance
5%
Current Density
7%
Diffusion
6%
Dissipation
5%
Dissolution
12%
Epitaxial Film
5%
Etching
9%
Eutectics
14%
Film Type Compound
31%
Foil
9%
Force
9%
Heat
5%
Intermetallic Compound
8%
Liquid Film
6%
Microstructure
9%
Nanorod
7%
Purity
8%
Pyramidal Crystal
7%
Reflectivity
5%
Shear Strength
5%
Solder
100%
Soldering
6%
Surface
11%
Surface Chemistry
16%
Transmittance
8%
Voltage
5%
White
5%