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查看斯高帕斯 (Scopus) 概要
劉 正毓
教授
化學工程與材料工程學系
光電科學研究中心
電子郵件
chengyi
cc.ncu.edu
tw
網站
http://www.cme.ncu.edu.tw/products_detail/29.htm
h-index
3250
引文
29
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1996 …
2024
每年研究成果
概覽
指紋
網路
研究成果
(176)
資料集
(2)
類似的個人檔案
(6)
指紋
查看啟用 Cheng-Yi Liu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Keyphrases
Electromigration
92%
Cu-Sn
74%
Soldering
53%
Cu6Sn5
45%
Sn-Cu
44%
Solder Joint
39%
Light-emitting Diodes
37%
GaN-based LED
36%
Interfacial Reaction
35%
Ni-P
32%
GaN-based Light-emitting Diodes
30%
Joint Interface
28%
Flip chip
28%
Compound Layer
28%
Annealing
27%
Sn-Cu Solder
27%
Cu Substrate
27%
Epilayer
25%
SnO2
25%
Patterned Sapphire Substrate
25%
P-type
24%
Sapphire Substrate
23%
Wafer Bonding
22%
Ag3Sn
22%
Ni-Sn
21%
Spalling
20%
GaN Surface
20%
High Power
19%
Solder Bump
18%
Cu3Sn
18%
SnPb Solder
18%
SnPb
18%
P-GaN
18%
Cu Pad
17%
Si Wafer
17%
Current Stressing
17%
AuSn
17%
Sn Solder
16%
Sn-Cu-Ni
16%
Interfacial Intermetallic Compound
15%
Low Temperature
15%
Microstructure
15%
ZnO Nanorods
15%
Induced Failures
14%
Current Density
14%
Self-forming
14%
Sn-Cu Alloy
14%
Flip Chip Solder Joints
13%
Under Bump Metallization
13%
SnO2 Thin Films
12%
Material Science
Light-Emitting Diode
100%
Surface (Surface Science)
73%
Thin Films
71%
Density
68%
Solder Joint
57%
Cathode
44%
Sapphire
39%
Film
31%
Oxide Compound
29%
Anode
27%
Intermetallics
26%
Void Growth
25%
Activation Energy
23%
Aluminum Nitride
22%
Annealing
22%
Alloying
20%
Copper Alloy
20%
ZnO
19%
Indium Tin Oxide
15%
Electrical Resistivity
13%
Composite Material
12%
Shear Strength
12%
Lead-Free Solder
11%
Carrier Concentration
10%
Grain Size
10%
Nucleation
10%
Waveguide
10%
Thermal Stability
10%
Grain Boundary
10%
Reflectivity
9%
X-Ray Photoelectron Spectroscopy
9%
Quantum Well
8%
Epilayers
8%
Thermal Expansion
8%
Carrier Mobility
8%
Oxygen Vacancy
7%
Wet Etching
7%
Photoemission Spectroscopy
7%
Stress Relaxation
7%
Wettability
7%
Carbon Nanotube
7%
Nanorod
7%
Epitaxial Film
7%
Silicon
7%
Doping (Additives)
7%
Microhardness
6%
Nitride Compound
6%
Gas Flow
6%
Plating
6%
Electroplating
6%
Engineering
Light-Emitting Diode
65%
Thin Films
47%
Electromigration
44%
Sapphire Substrate
34%
Compound Layer
32%
Wafer Bonding
23%
Alloying
20%
Eutectics
19%
Joint Interface
19%
Reflectance
18%
Nitride
18%
Low-Temperature
17%
Si Wafer
17%
Intermetallics
17%
Barrier Layer
17%
Quantum Well
16%
Light Extraction Efficiency
14%
Metallizations
13%
Driving Force
13%
Joints (Structural Components)
12%
Compound Formation
12%
Retardation
11%
Solder Bump
10%
Si Substrate
10%
Raman Spectra
10%
Sandwich Structures
10%
Forward Voltage
10%
Conductive
9%
Light Extraction
9%
Failure Mode
9%
Waveguide
9%
Ray Photoelectron Spectroscopy
9%
Interconnects
8%
Shear Strength
8%
Bonding System
8%
Photocurrent
7%
Compressive Stress
7%
Output Power
7%
Bonding Process
7%
Alloy Composition
7%
Nanorod
7%
Cavity Surface
7%
Emitting Laser
7%
Carbon Nanotube
7%
Void Growth
7%
Copper Substrate
6%
Surface Morphology
6%
Cu Film
6%
Mols
6%
Ambient Air
6%
