劉 正毓

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• Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth

  Lee, Y.-F. (???dataset.roles.dataset.creator???), Huang, Y.-C. (???dataset.roles.dataset.creator???), Chang, J.-S. (???dataset.roles.dataset.creator???), Cheng, T.-Y. (???dataset.roles.dataset.creator???), Chen, P.-Y. (???dataset.roles.dataset.creator???), Huang, W.-C. (???dataset.roles.dataset.creator???), Lo, M.-H. (???dataset.roles.dataset.creator???), Fu, K.-L. (???dataset.roles.dataset.creator???), Lai, T.-L. (???dataset.roles.dataset.creator???), Chang, P.-K. (???dataset.roles.dataset.creator???), Yu, Z.-Y. (???dataset.roles.dataset.creator???) & Liu, C.-Y. (???dataset.roles.dataset.creator???), The Royal Society, 2024

  DOI: 10.6084/m9.figshare.26956246, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246

  資料集

• Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth

  Lee, Y.-F. (???dataset.roles.dataset.creator???), Huang, Y.-C. (???dataset.roles.dataset.creator???), Chang, J.-S. (???dataset.roles.dataset.creator???), Cheng, T.-Y. (???dataset.roles.dataset.creator???), Chen, P.-Y. (???dataset.roles.dataset.creator???), Huang, W.-C. (???dataset.roles.dataset.creator???), Lo, M.-H. (???dataset.roles.dataset.creator???), Fu, K.-L. (???dataset.roles.dataset.creator???), Lai, T.-L. (???dataset.roles.dataset.creator???), Chang, P.-K. (???dataset.roles.dataset.creator???), Yu, Z.-Y. (???dataset.roles.dataset.creator???) & Liu, C.-Y. (???dataset.roles.dataset.creator???), The Royal Society, 2024

  DOI: 10.6084/m9.figshare.26956246.v1, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1

  資料集