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研究領域
發光二極體,晶圓鍵合技術,無線寬頻晶片覆晶封裝技術,電致遷移熱遷移研究
與 UN SDG 相關的專業知識
聯合國會員國於 2015 年同意 17 項全球永續發展目標 (SDG)，以終結貧困、保護地球並確保全體的興盛繁榮。此人的作品有助於以下永續發展目標：
指紋
查看啟用 Cheng-Yi Liu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
專案
- 33 已完成
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Electromigration behavior and failure mechanism of micro-bump applications
Liu, C.-Y. (PI)
1/03/24 → 28/02/25
研究計畫: Research
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Abrasion Tests on Nanotwinned and Graphene-Doped Ag Films Prepared by Cyanide-Free Ag Electroplating
Fu, K. L., Yang, L. H. C., Lo, M. H., Cheng, T. Y., Huang, Y. C., Yu, Z. Y., Hsu, C. E., Lin, K. C., Chiu, C. W., Wu, A. T. & Liu, C. Y., 2025, (已被接受) 於: Tribology Transactions.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
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Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating
Yu, Z. Y., Wu, C. Y., Fu, K. L., Chang, J. S., Yen, T. H., Tsai, C. P., Hsu, Y. H., Lee, Y. F. & Liu, C. Y., 1月 2025, 於: Journal of Materials Science: Materials in Electronics. 36, 1, 84.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
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EM induced voiding mechanism in trapped Sn phase inside massive Cu Sn compound
Chen, P. Y., Tsai, C. P., Yang, L. H. C., Lin, K. C., Chiu, C. W., Hsu, C. E., Chiu, C. Y., Chang, J. S., Chiu, C. N., Chu, D. T., Chuang, Y. C. & Liu, C. Y., 2025, (已被接受) 於: IEEE Transactions on Components, Packaging and Manufacturing Technology.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
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Fast formation mechanism of Cu6Sn5 compound in Sn/Bi/Cu by atomic diffusion in Bi lattice
Yeh, C. Y. & Liu, C. Y., 4月 2025, 於: Materials Today Communications. 45, 112215.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
1 引文 斯高帕斯（Scopus） -
Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu
Lee, Y. F., Chiu, C. W., Chiu, C. Y., Huang, Y. C., Lo, M. H., Yang, L. H. C., Cheng, T. Y., Yu, Z. Y., Hsu, C. E., Lin, K. C., Chen, P. Y., Huang, W. C., Chang, J. S., Pan, S. A., Su, Y. C., Lin, C. L., Hsieh, H. C., Lin, C. H. & Liu, C. Y., 12月 2025, 於: Scientific Reports. 15, 1, 30978.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
開啟存取
資料集
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (???dataset.roles.dataset.creator???), Huang, Y.-C. (???dataset.roles.dataset.creator???), Chang, J.-S. (???dataset.roles.dataset.creator???), Cheng, T.-Y. (???dataset.roles.dataset.creator???), Chen, P.-Y. (???dataset.roles.dataset.creator???), Huang, W.-C. (???dataset.roles.dataset.creator???), Lo, M.-H. (???dataset.roles.dataset.creator???), Fu, K.-L. (???dataset.roles.dataset.creator???), Lai, T.-L. (???dataset.roles.dataset.creator???), Chang, P.-K. (???dataset.roles.dataset.creator???), Yu, Z.-Y. (???dataset.roles.dataset.creator???) & Liu, C.-Y. (???dataset.roles.dataset.creator???), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246.v1, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1
資料集
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (???dataset.roles.dataset.creator???), Huang, Y.-C. (???dataset.roles.dataset.creator???), Chang, J.-S. (???dataset.roles.dataset.creator???), Cheng, T.-Y. (???dataset.roles.dataset.creator???), Chen, P.-Y. (???dataset.roles.dataset.creator???), Huang, W.-C. (???dataset.roles.dataset.creator???), Lo, M.-H. (???dataset.roles.dataset.creator???), Fu, K.-L. (???dataset.roles.dataset.creator???), Lai, T.-L. (???dataset.roles.dataset.creator???), Chang, P.-K. (???dataset.roles.dataset.creator???), Yu, Z.-Y. (???dataset.roles.dataset.creator???) & Liu, C.-Y. (???dataset.roles.dataset.creator???), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246
資料集