每年專案
個人檔案
研究領域
發光二極體,晶圓鍵合技術,無線寬頻晶片覆晶封裝技術,電致遷移熱遷移研究
與 UN SDG 相關的專業知識
聯合國會員國於 2015 年同意 17 項全球永續發展目標 (SDG)，以終結貧困、保護地球並確保全體的興盛繁榮。此人的作品有助於以下永續發展目標：
指紋
查看啟用 Cheng-Yi Liu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films
Chang, J. S., Chiu, C. Y., Huang, Y. C., Cheng, T. Y., Yu, Z. Y., Lo, M. H. & Liu, C. Y., 6月 2024, 於: JOM. 76, 6, p. 2711-2717 7 p.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
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Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
Hsu, Y. H., Lo, M. H., Lee, Y. C., Huang, W. C., Chang, J. S., Wang, Y. P. & Liu, C. Y., 4月 2024, 於: Journal of Materials Science: Materials in Electronics. 35, 10, 678.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
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High transparent and conductive ZnO/Ag/ZnO film structure
Li, B. J., Chen, W. H., Huang, C. K., Chou, C. Y., Lai, T. L., Fu, K. L. & Liu, C. Y., 6月 2024, 於: Materials Today Communications. 39, 109201.研究成果: 雜誌貢獻 › 回顧評介論文 › 同行評審
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Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation
Tsai, C. P., Chiu, C. Y., Huang, W. C., Liu, C. Y., Chang, J. S., Chiu, C. N. & Chuang, Y. C., 15 2月 2024, 於: Materials Letters. 357, 135729.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
2 引文 斯高帕斯（Scopus） -
Stacking Fault and Plastic Deformation Mechanism in Nano-twinned Cu Pillar under Ultrahigh Stress
Fu, K. L., Lee, Y. F., Chang, J. S., Lee, C. H., Chen, P. Y., Huang, W. C., Lo, M. H., Huang, Y. C. & Liu, C. Y., 11月 2024, 於: Advanced Engineering Materials. 26, 21, 2400990.研究成果: 雜誌貢獻 › 期刊論文 › 同行評審
資料集
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (???dataset.roles.dataset.creator???), Huang, Y.-C. (???dataset.roles.dataset.creator???), Chang, J.-S. (???dataset.roles.dataset.creator???), Cheng, T.-Y. (???dataset.roles.dataset.creator???), Chen, P.-Y. (???dataset.roles.dataset.creator???), Huang, W.-C. (???dataset.roles.dataset.creator???), Lo, M.-H. (???dataset.roles.dataset.creator???), Fu, K.-L. (???dataset.roles.dataset.creator???), Lai, T.-L. (???dataset.roles.dataset.creator???), Chang, P.-K. (???dataset.roles.dataset.creator???), Yu, Z.-Y. (???dataset.roles.dataset.creator???) & Liu, C.-Y. (???dataset.roles.dataset.creator???), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246
資料集
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (???dataset.roles.dataset.creator???), Huang, Y.-C. (???dataset.roles.dataset.creator???), Chang, J.-S. (???dataset.roles.dataset.creator???), Cheng, T.-Y. (???dataset.roles.dataset.creator???), Chen, P.-Y. (???dataset.roles.dataset.creator???), Huang, W.-C. (???dataset.roles.dataset.creator???), Lo, M.-H. (???dataset.roles.dataset.creator???), Fu, K.-L. (???dataset.roles.dataset.creator???), Lai, T.-L. (???dataset.roles.dataset.creator???), Chang, P.-K. (???dataset.roles.dataset.creator???), Yu, Z.-Y. (???dataset.roles.dataset.creator???) & Liu, C.-Y. (???dataset.roles.dataset.creator???), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246.v1, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1
資料集