Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth

  • Y. F. Lee (???dataset.roles.dataset.creator???)
  • Yu Chen Huang (???dataset.roles.dataset.creator???)
  • J. S. Chang (???dataset.roles.dataset.creator???)
  • Ting Yi Cheng (???dataset.roles.dataset.creator???)
  • Po Yu Chen (???dataset.roles.dataset.creator???)
  • Wei Chieh Huang (???dataset.roles.dataset.creator???)
  • Mei Hsin Lo (???dataset.roles.dataset.creator???)
  • K. L. Fu (???dataset.roles.dataset.creator???)
  • Tse Lin Lai (???dataset.roles.dataset.creator???)
  • Po Kai Chang (???dataset.roles.dataset.creator???)
  • Zhong Yen Yu (???dataset.roles.dataset.creator???)
  • Cheng-Yi Liu (???dataset.roles.dataset.creator???)

資料集

資料集描述

electronic supplementary material (ESM)-dataset.xlsx
可用日期2024
發行者The Royal Society

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