Wear and corrosion behaviors of SiCp reinforced copper matrix composite formed by hot pressing

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Abstract

Wear and corrosion behaviors of SiCp reinforced copper matrix composite formed by hot pressing were studied. The results show that the tensile strength, hardness and material porosity increased with the increase of SiCp content. The wear rate of Cu/SiCp composites decreased with the increase of SiCp content, applied load and high sliding velocity (exceeds 300 rpm). In contrast the wear rate of Cu/SiCp composites increased with low sliding velocity (100 rpm to 300 rpm). A dramatic wear rate of Cu/SiCp composite is observed at the initial wear stage (0-400 m). However, when sliding distance exceeds 800 m, the wear behavior becomes more stable. In addition, the corrosion resistance of Cu/SiCp composite in 5% NaCl solution increases with increasing pH value, but decreases with increasing SiCp content. Pits always initiate at the interfacial boundary between SiCp and copper, which makes SiCp particles peeling and copper matrix pitting deeply.

Original languageEnglish
Pages (from-to)9-16
Number of pages8
JournalScandinavian Journal of Metallurgy
Volume28
Issue number1
StatePublished - Feb 1999

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