Wafer positioning by laser scanning method

Ju Yi Lee, Yi Cheng Chen, Jian You Chen, Yun Yan Lee, Yu Bin Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations


A laser scanning method for wafer positioning is proposed. This wafer positioning method incorporates a laser scanner system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The position of wafer relative to the robot plate is determined by signal processing of the time-sequence signal. The measurement precision is about 0.3 mm.

Original languageEnglish
Title of host publicationSICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts
PublisherSociety of Instrument and Control Engineers (SICE)
Number of pages5
ISBN (Print)9784907764395
StatePublished - 2011
Event50th Annual Conference on Society of Instrument and Control Engineers, SICE 2011 - Tokyo, Japan
Duration: 13 Sep 201118 Sep 2011

Publication series

NameProceedings of the SICE Annual Conference


Conference50th Annual Conference on Society of Instrument and Control Engineers, SICE 2011


  • Laser scanning
  • Wafer positioning


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