W -band flip-chip assembled CMOS amplifier with transition compensation network for SiP integration

Che Chung Kuo, Po An Lin, Hsin Chia Lu, Yu Sian Jiang, Chia Ming Liu, Yue Ming Hsin, Huei Wang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

In this paper, a 94 GHz flip-chip assembled CMOS amplifier with transition compensation is presented. Flip-chip process with a bump size (30 μm × 30 μm × 27 μm) is developed for millimeter-wave applications. Without the flip-chip transition compensation, the frequencies of the best return losses of the amplifier shifts to 82-85 GHz, which deviate from the bare die measurement results of 96 GHz. By applying the compensation network in the transition, the dips of the return loss become much closer to the bare die measurement results. To the best of our knowledge, this is the first demonstration of a CMOS amplifier with flip-chip connection in millimeter-wave frequencies.

Original languageEnglish
Title of host publication2010 IEEE MTT-S International Microwave Symposium, MTT 2010
Pages465-468
Number of pages4
DOIs
StatePublished - 2010
Event2010 IEEE MTT-S International Microwave Symposium, MTT 2010 - Anaheim, CA, United States
Duration: 23 May 201028 May 2010

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Conference

Conference2010 IEEE MTT-S International Microwave Symposium, MTT 2010
Country/TerritoryUnited States
CityAnaheim, CA
Period23/05/1028/05/10

Keywords

  • CMOS
  • Flip-chip
  • Millimeter wave
  • W-band

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