A high performance VLSI architecture is proposed for the 3D sound generation chip. A single 3D sound chip design reduces the cost and size of many audio systems. The proposed 3D sound VLSI architecture has the following merits: excellent accuracy results due to the accuracy studies for the finite word length; high speed operations owing to the high performance concurrent processing structure; and real-time response for 44.1 KHz sampling data.
|Number of pages
|Digest of Technical Papers - IEEE International Conference on Consumer Electronics
|Published - 1997
|Proceedings of the 1997 16th International Conference on Consumer Electronics, ICCE - Rosemont, IL, USA
Duration: 11 Jun 1997 → 13 Jun 1997