Very high deposition rate of a-Si:H thin films by ECRCVD

H. F. Chiu, Y. S. Chang, J. Y. Wu, Y. S. Li, J. Y. Chang, C. C. Lee, I. C. Chen, C. C. Su, Tomi T. Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

For the reduction of the manufacturing cost, a high deposition rate of amorphous silicon (a-Si:H) thin film in fabrication is very important. Thus high plasma density and low process temperature deposition technique is keen to develop. Another issue of a-Si:H thin film uses plasma enhanced CVD which causes plasma damage to the film. We use electron cyclotron resonance chemical vapor deposition (ECRCVD) to deposit a-Si:H layers with varying microwave power, magnetic field, and hydrogen dilution. The major advantages of ECRCVD are high deposition rate and remote plasma zone that can avoid surface damage. A high deposition rate more than 2 nm/sec was developed by ECRCVD. Fourier transform infrared spectroscopy (FTIR) is used for measuring the microstructure factor (R*) to interpret the effects of microwave power, magnetic field, and hydrogen dilution.

Original languageEnglish
Title of host publicationChina Semiconductor Technology International Conference 2011, CSTIC 2011
Pages1165-1171
Number of pages7
Edition1
DOIs
StatePublished - 2011
Event10th China Semiconductor Technology International Conference 2011, CSTIC 2011 - Shanghai, China
Duration: 13 Mar 201114 Mar 2011

Publication series

NameECS Transactions
Number1
Volume34
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference10th China Semiconductor Technology International Conference 2011, CSTIC 2011
Country/TerritoryChina
CityShanghai
Period13/03/1114/03/11

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