Use of 3,3-thiobis(1-propanesulfonate) to accelerate microvia filling by copper electroplating

Po Fana Chan, Yong Da Chiu, Wei Ping Dow, Klaus Krug, Yuh Lang Lee, Shueh Lin Yauc

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

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Engineering & Materials Science

Chemical Compounds