Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes

Yu Chieh Huang, Po Tsang Huang, Shang Lin Wu, Yu Chen Hu, Yan Huei You, Jr Ming Chen, Yan Yu Huang, Hsiao Chun Chang, Yen Han Lin, Jeng Ren Duann, Tzai Wen Chiu, Wei Hwang, Kuan Neng Chen, Ching Te Chuang, Jin Chern Chiou

Research output: Contribution to journalArticlepeer-review

10 Scopus citations


Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm × 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 μW per channel. The overall power of this microsystem is only 3.79 mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm × 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.

Original languageEnglish
Article number7890380
Pages (from-to)1013-1025
Number of pages13
JournalIEEE Transactions on Biomedical Circuits and Systems
Issue number5
StatePublished - Oct 2017


  • Electrocorticography (ECoG)
  • TSV-embedded μ-needles
  • local field potential (LFP)
  • microsystem
  • probe
  • somatosensory evoked potential (SSEP)


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