Thermal management: Component to systems level

Te Yuan Chung

doi:10.1007/978-3-319-00176-0_60

Thermal management: Component to systems level

Te Yuan Chung

Department of Optics and Photonics

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

1 Scopus citations

Abstract

Thermal management is one of the most essential issues for LED applications. The output power, efficiency, emission spectrum and reliability of the LED chip and phosphor are functions of temperature. Without proper thermal management, the output of the LED could depart from the desired performance. Basic heat transfer phenomena and corresponding calculations are introduced as well as the thermal behaviors and concerns of the essential components of an LED. A quick method to estimate the thermal resistance of an LED package is provided based on the shape factor of the geometry at the end of this chapter.

Original language	English
Title of host publication	Handbook of Advanced Lighting Technology
Publisher	Springer International Publishing
Pages	239-267
Number of pages	29
ISBN (Electronic)	9783319001760
ISBN (Print)	9783319001753
DOIs	https://doi.org/10.1007/978-3-319-00176-0_60
State	Published - 1 Jan 2017

Access to Document

10.1007/978-3-319-00176-0_60

Cite this

@inbook{e442ce0afb264d54a13b213c4b7fa0ff,

title = "Thermal management: Component to systems level",

abstract = "Thermal management is one of the most essential issues for LED applications. The output power, efficiency, emission spectrum and reliability of the LED chip and phosphor are functions of temperature. Without proper thermal management, the output of the LED could depart from the desired performance. Basic heat transfer phenomena and corresponding calculations are introduced as well as the thermal behaviors and concerns of the essential components of an LED. A quick method to estimate the thermal resistance of an LED package is provided based on the shape factor of the geometry at the end of this chapter.",

author = "Chung, {Te Yuan}",

note = "Publisher Copyright: {\textcopyright} Springer International Publishing Switzerland 2017. All rights are reserved.",

year = "2017",

month = jan,

day = "1",

doi = "10.1007/978-3-319-00176-0_60",

language = "???core.languages.en_GB???",

isbn = "9783319001753",

pages = "239--267",

booktitle = "Handbook of Advanced Lighting Technology",

publisher = "Springer International Publishing",

}

TY - CHAP

T1 - Thermal management

T2 - Component to systems level

AU - Chung, Te Yuan

PY - 2017/1/1

Y1 - 2017/1/1

N2 - Thermal management is one of the most essential issues for LED applications. The output power, efficiency, emission spectrum and reliability of the LED chip and phosphor are functions of temperature. Without proper thermal management, the output of the LED could depart from the desired performance. Basic heat transfer phenomena and corresponding calculations are introduced as well as the thermal behaviors and concerns of the essential components of an LED. A quick method to estimate the thermal resistance of an LED package is provided based on the shape factor of the geometry at the end of this chapter.

AB - Thermal management is one of the most essential issues for LED applications. The output power, efficiency, emission spectrum and reliability of the LED chip and phosphor are functions of temperature. Without proper thermal management, the output of the LED could depart from the desired performance. Basic heat transfer phenomena and corresponding calculations are introduced as well as the thermal behaviors and concerns of the essential components of an LED. A quick method to estimate the thermal resistance of an LED package is provided based on the shape factor of the geometry at the end of this chapter.

UR - http://www.scopus.com/inward/record.url?scp=85052768912&partnerID=8YFLogxK

U2 - 10.1007/978-3-319-00176-0_60

DO - 10.1007/978-3-319-00176-0_60

M3 - 篇章

AN - SCOPUS:85052768912

SN - 9783319001753

SP - 239

EP - 267

BT - Handbook of Advanced Lighting Technology

PB - Springer International Publishing

ER -

Thermal management: Component to systems level

Abstract

Access to Document

Fingerprint

Cite this