Fingerprint
Dive into the research topics of 'Thermal design in diode array packaging'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Thermal design in diode array packaging
Y. R. Lin, T. Y. Chung, J. H. Du, L. C. Chow, M. Bass, D. P. Rini
Research output: Contribution to journal › Conference article › peer-review