Thermal design in diode array packaging

Y. R. Lin; T. Y. Chung; J. H. Du; L. C. Chow; M. Bass; D. P. Rini

doi:10.4271/2002-01-3261

Thermal design in diode array packaging

Y. R. Lin, T. Y. Chung, J. H. Du, L. C. Chow, M. Bass, D. P. Rini

Department of Optics and Photonics

Research output: Contribution to journal › Conference article › peer-review

Abstract

Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.

Original language	English
Journal	SAE Technical Papers
DOIs	https://doi.org/10.4271/2002-01-3261
State	Published - 2002
Event	Power Systems Conference - Coral Springs, FL, United States Duration: 29 Oct 2002 → 31 Oct 2002

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abstract = "Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.",

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AU - Lin, Y. R.

AU - Chung, T. Y.

AU - Du, J. H.

AU - Chow, L. C.

AU - Bass, M.

AU - Rini, D. P.

PY - 2002

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AB - Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.

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JO - SAE Technical Papers

JF - SAE Technical Papers

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Thermal design in diode array packaging

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