Thermal analysis and experimental validation on TFT-LCD panels for image quality concerns

Ng Yi Chu, Min Chun Pan, Johnson Ho

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

15 Scopus citations

Abstract

The heat source from cold cathode fluorescent lamps (CCFLs) in the backlight module of a TFT-LCD TV causes the cell assembly to warpage. The extruding phenomenon, appearing between the cell and its bezel, leads to defects in display of the TFT-LCD TV. The study successfully simulates and predicts the process by finite element analysis (FEA), computational fluid dynamics (CFD), and structure-heat transfer. The paper also shows the efficient experimental verification which uses kinds of physical sensors to measure the temperature variation and thermal stresses on the surface of LCD-TV cell. The achievements and techniques can be employed to analyze and design the geometric parameters of different components in LCD-TV modules for product optimization.

Original languageEnglish
Title of host publicationProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Pages543-548
Number of pages6
StatePublished - 2005
Event7th Electronics Packaging Technology Conference, EPTC 2005 - Singapore, Singapore
Duration: 7 Dec 20059 Dec 2005

Publication series

NameProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Volume2

Conference

Conference7th Electronics Packaging Technology Conference, EPTC 2005
Country/TerritorySingapore
CitySingapore
Period7/12/059/12/05

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