@inproceedings{9c95c2d5f9684c438e3972dd2b400418,
title = "Thermal analysis and experimental validation on TFT-LCD panels for image quality concerns",
abstract = "The heat source from cold cathode fluorescent lamps (CCFLs) in the backlight module of a TFT-LCD TV causes the cell assembly to warpage. The extruding phenomenon, appearing between the cell and its bezel, leads to defects in display of the TFT-LCD TV. The study successfully simulates and predicts the process by finite element analysis (FEA), computational fluid dynamics (CFD), and structure-heat transfer. The paper also shows the efficient experimental verification which uses kinds of physical sensors to measure the temperature variation and thermal stresses on the surface of LCD-TV cell. The achievements and techniques can be employed to analyze and design the geometric parameters of different components in LCD-TV modules for product optimization.",
author = "Chu, {Ng Yi} and Pan, {Min Chun} and Johnson Ho",
year = "2005",
language = "???core.languages.en_GB???",
isbn = "0780395786",
series = "Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005",
pages = "543--548",
booktitle = "Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005",
note = "7th Electronics Packaging Technology Conference, EPTC 2005 ; Conference date: 07-12-2005 Through 09-12-2005",
}