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Thermal aging effect on the joint strength between an SOFC glass-ceramic sealant and LSM-coated metallic interconnect
Fan Lin Hou, Chih Kuang Lin, Atsushi Sugeta, Hiroyuki Akebono, Szu Han Wu, Peng Yang, Ruey Yi Lee
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1
Scopus
citations