The heat dissipation performance of LED applied a MHP

Gwo Jiun Sheu; Farn Shiun Hwu; Shen Hang Tu; Wen Tung Chen; Jenq Yang Chang; Jyh Chen Chen

doi:10.1117/12.616355

The heat dissipation performance of LED applied a MHP

Gwo Jiun Sheu, Farn Shiun Hwu, Shen Hang Tu, Wen Tung Chen, Jenq Yang Chang, Jyh Chen Chen

Research output: Contribution to journal › Conference article › peer-review

21 Scopus citations

Abstract

This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.

Original language	English
Article number	594113
Pages (from-to)	1-8
Number of pages	8
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	5941
DOIs	https://doi.org/10.1117/12.616355
State	Published - 2005
Event	Fifth International Conference on Solid State Lighting - San Diego, CA, United States Duration: 1 Aug 2005 → 4 Aug 2005

Keywords

Heat dissipation
LED
Miniature heat pipe (MHP)

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10.1117/12.616355

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title = "The heat dissipation performance of LED applied a MHP",

abstract = "This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.",

keywords = "Heat dissipation, LED, Miniature heat pipe (MHP)",

author = "Sheu, {Gwo Jiun} and Hwu, {Farn Shiun} and Tu, {Shen Hang} and Chen, {Wen Tung} and Chang, {Jenq Yang} and Chen, {Jyh Chen}",

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T1 - The heat dissipation performance of LED applied a MHP

AU - Sheu, Gwo Jiun

AU - Hwu, Farn Shiun

AU - Tu, Shen Hang

AU - Chen, Wen Tung

AU - Chang, Jenq Yang

AU - Chen, Jyh Chen

PY - 2005

Y1 - 2005

N2 - This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.

AB - This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.

KW - Heat dissipation

KW - LED

KW - Miniature heat pipe (MHP)

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T2 - Fifth International Conference on Solid State Lighting

Y2 - 1 August 2005 through 4 August 2005

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The heat dissipation performance of LED applied a MHP

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