The heat dissipation performance of LED applied a MHP

Gwo Jiun Sheu, Farn Shiun Hwu, Shen Hang Tu, Wen Tung Chen, Jenq Yang Chang, Jyh Chen Chen

Research output: Contribution to journalConference articlepeer-review

21 Scopus citations


This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.

Original languageEnglish
Article number594113
Pages (from-to)1-8
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - 2005
EventFifth International Conference on Solid State Lighting - San Diego, CA, United States
Duration: 1 Aug 20054 Aug 2005


  • Heat dissipation
  • LED
  • Miniature heat pipe (MHP)


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