The effects of solid-state aging on the intermetallic compounds of Sn-Ag-Bi-In solders on Cu substrates

Albert T. Wu, Ming Hsun Chen, Ciou Nan Siao

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

The growth behavior of the intermetallic compounds that formed at the interfaces between Sn-Ag-Bi-In solders and Cu substrates during solid-state aging is investigated. The compositions of the intermetallic compounds are Cu 3(Sn,In) near the Cu substrates and Cu 6(Sn,In) 5 near the solders; very little Bi or Ag was dissolved in the compounds. The aging temperatures were 120°C, 150°C, and 180°C for 5 days, 10 days, 20 days, and 40 days. The change in the morphology of Cu 6(Sn,In) 5 from scallop type to layer type was prominent at the aging temperature of 180°C. The thickness of the compound layers did not vary much at the lower aging temperatures but followed the diffusion- controlled mechanism at 180°C. Massive Kirkendall voids were observed in Cu 3(Sn,In) layers at the aging temperature of 180°C.

Original languageEnglish
Pages (from-to)252-256
Number of pages5
JournalJournal of Electronic Materials
Volume38
Issue number2
DOIs
StatePublished - Feb 2009

Keywords

  • Kirkendall void
  • Pb-free
  • Sn-Ag-Bi-In solder
  • Solid-state aging

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