The effect of thermomigration on phase coarsening in a eutectic SnPb alloy

Y. C. Chuang, C. Y. Liu

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The effect of thermomigration (TM) on the phase coarsening behavior of eutectic SnPb solder was studied. TM generates a Pb atomic flux which diffuses from the hot side to the cold side. We found the coarsening rate of phases in the SnPb solder to be enhanced by the TM Pb flux and the degree of TM enhancement to increase as the temperature decreases. A detailed mechanism explaining the coarsening enhancement is outlined and discussed.

Original languageEnglish
Pages (from-to)1495-1500
Number of pages6
JournalJournal of Electronic Materials
Volume36
Issue number11
DOIs
StatePublished - Nov 2007

Keywords

  • Packaging
  • Thermomigration

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