Abstract
The effect of thermomigration (TM) on the phase coarsening behavior of eutectic SnPb solder was studied. TM generates a Pb atomic flux which diffuses from the hot side to the cold side. We found the coarsening rate of phases in the SnPb solder to be enhanced by the TM Pb flux and the degree of TM enhancement to increase as the temperature decreases. A detailed mechanism explaining the coarsening enhancement is outlined and discussed.
Original language | English |
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Pages (from-to) | 1495-1500 |
Number of pages | 6 |
Journal | Journal of Electronic Materials |
Volume | 36 |
Issue number | 11 |
DOIs | |
State | Published - Nov 2007 |
Keywords
- Packaging
- Thermomigration