The effect of SiCp content on the corrosion behaviour of copper-matrix composites

Yuang Fa Lee, Sheng Long Lee, Chi Hung Huang, Dei Xe Chen

Research output: Contribution to journalArticlepeer-review

Abstract

THE CORROSION behaviour of low-vol.% and high-vol.% of a SiCp reinforced copper matrix composite immersed in 5% NaCl solution of pH6.7 was studied. The results show that the corrosion resistance of the low-vol.% SiCp content of Cu/SiCp composite decreases with increasing SiCp volume fraction. On the other hand, the corrosion resistance of the high-vol.% SiCp content of Cu/SiCp composite increases with increasing SiCp volume fraction. The corrosion potential trends towards being more active as the SiCp content of the Cu/SiCp composite increases, both at low-vol.% of SiCp and at high-vol.% of SiCp of copper matrix composite. Pits and crevices always initiate at the interfacial boundary between the SiCp particles and the Cu matrix, which makes SiCp peeling and copper matrix pitting.

Original languageEnglish
Pages (from-to)107-112
Number of pages6
JournalCorrosion Prevention and Control
Volume47
Issue number4
StatePublished - Dec 2000

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