This study aims to exploit an integrated-circuit (IC) testing model based on a statistical simulation method to evaluate the test yield and quality of IC products. Using normal probability distributions of product properties, we digitally analyzed IC yield and quality, introduced testing threshold and guardband, and assessed various parameters' influence on outcomes. Because future manufacturing speed is unpredictable, we used current manufacturing technology and existing-product electrical properties to estimate future product-distribution trends. Since the progress of developmental improvements for testing technologies has been slow, it has become a greater challenge for a supplier to determine the use of existing instruments and tools to achieve quality products with near-zero defects. To improve product quality, a new scheme of Multiple tests has been proposed. Moreover, we used a set of parameters from the International Technology Roadmap for Semiconductors (ITRS) to demonstrate the proposed Multiple testing, and to show that the test yield can be improved while attaining the desired quality.