Surface roughening of silicon wafer solar cell by using ecdm method

Hai Ping Tsui, Kuang Hua Chang, Biing Hwa Yan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This research proposes surface roughening of silicon wafer solar cell by electrochemical discharge machining (ECDM). The stainless steel was used as negative electrode. The graphite was used as the positive electrode acting as the auxiliary electrode. The potassium hydroxide was used as the electrolyte. The processing parameters include the machining voltage, the processing time, the machining gap, the electrolyte concentration, the additive agent concentration, pulse frequency and duty factor, etc. The result of experiments reveals that appropriate concentrations of ethanol can expand the size of the pores and enhance surface roughening effect. The appropriate processing parameters are a machining gap of 200μm, voltage of 48V, concentration of potassium hydroxide of 3M, concentration of ethanol of 4%. The electrochemical discharge machined surface roughness was increased from 0.417μm to 0.915μm using one minute processing time. The average reflectance rate of the textured surface was decreased from 29.6% to 12.7%. This study reveals that ECDM method has the advantage of short processing time and can generate a higher surface roughness and the porous structure.

Original languageEnglish
Title of host publicationRecent Development in Machining, Materials and Mechanical Technologies III
EditorsHuy Bich Nguyen
PublisherTrans Tech Publications Ltd
Pages62-70
Number of pages9
ISBN (Print)9783035714821
DOIs
StatePublished - 2019
EventInternational Conference on Machining, Materials and Mechanical Technologies, IC3MT 2018 - Ho Chi Minh City, Viet Nam
Duration: 19 Sep 201822 Sep 2018

Publication series

NameKey Engineering Materials
Volume825 KEM
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Conference

ConferenceInternational Conference on Machining, Materials and Mechanical Technologies, IC3MT 2018
Country/TerritoryViet Nam
CityHo Chi Minh City
Period19/09/1822/09/18

Keywords

  • Electrical chemical discharge machining
  • Reflectance rate
  • Silicon wafer solar cell
  • Surface roughening

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