Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency

Vivien Yi Chun Chen; Kai Chun Chu; Kuo Chi Chang; Der Juinn Horng; Jerry Chao Lee Lin

doi:10.1109/IMPACT.2018.8625816

Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency

Vivien Yi Chun Chen, Kai Chun Chu, Kuo Chi Chang, Der Juinn Horng, Jerry Chao Lee Lin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

This study uses chemical substances and products for wet etching and dry etching. In the table the etching process hazard analysis is also performed and aimed at the new project of the change system, and completed HAZOP analysis for raw of material changes and establish improvement measures. After the risk control measures established by the institute, it was found that unsafe behaviors effectively improved the focus of the "gas cylinder replacement operation" in 2017 was reduced from 24 to 8 pieces.

Original language	English
Title of host publication	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Publisher	IEEE Computer Society
Pages	222-225
Number of pages	4
ISBN (Electronic)	9781538656150
DOIs	https://doi.org/10.1109/IMPACT.2018.8625816
State	Published - 2 Jul 2018
Event	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan Duration: 24 Oct 2018 → 26 Oct 2018

Publication series

Name	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume	2018-October
ISSN (Print)	2150-5934
ISSN (Electronic)	2150-5942

Conference

Conference	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Country/Territory	Taiwan
City	Taipei
Period	24/10/18 → 26/10/18

Keywords

10nm process
Etching process and facility system
Inherently safer design
Risk assessment

Access to Document

10.1109/IMPACT.2018.8625816

Cite this

Chen, V. Y. C., Chu, K. C., Chang, K. C., Horng, D. J., & Lin, J. C. L. (2018). Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency. In 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 (pp. 222-225). Article 8625816 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2018.8625816

Chen, Vivien Yi Chun ; Chu, Kai Chun ; Chang, Kuo Chi et al. / Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency. 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2018. pp. 222-225 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

@inproceedings{a6ec1a3f2d8347cda96fd405f29fd376,

title = "Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency",

abstract = "This study uses chemical substances and products for wet etching and dry etching. In the table the etching process hazard analysis is also performed and aimed at the new project of the change system, and completed HAZOP analysis for raw of material changes and establish improvement measures. After the risk control measures established by the institute, it was found that unsafe behaviors effectively improved the focus of the {"}gas cylinder replacement operation{"} in 2017 was reduced from 24 to 8 pieces.",

keywords = "10nm process, Etching process and facility system, Inherently safer design, Risk assessment",

author = "Chen, {Vivien Yi Chun} and Chu, {Kai Chun} and Chang, {Kuo Chi} and Horng, {Der Juinn} and Lin, {Jerry Chao Lee}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 ; Conference date: 24-10-2018 Through 26-10-2018",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/IMPACT.2018.8625816",

language = "???core.languages.en_GB???",

series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",

publisher = "IEEE Computer Society",

pages = "222--225",

booktitle = "13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018",

}

Chen, VYC, Chu, KC, Chang, KC, Horng, DJ & Lin, JCL 2018, Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency. in 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018., 8625816, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, vol. 2018-October, IEEE Computer Society, pp. 222-225, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018, Taipei, Taiwan, 24/10/18. https://doi.org/10.1109/IMPACT.2018.8625816

Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency. / Chen, Vivien Yi Chun; Chu, Kai Chun; Chang, Kuo Chi et al.
13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2018. p. 222-225 8625816 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency

AU - Chen, Vivien Yi Chun

AU - Chu, Kai Chun

AU - Chang, Kuo Chi

AU - Horng, Der Juinn

AU - Lin, Jerry Chao Lee

PY - 2018/7/2

Y1 - 2018/7/2

N2 - This study uses chemical substances and products for wet etching and dry etching. In the table the etching process hazard analysis is also performed and aimed at the new project of the change system, and completed HAZOP analysis for raw of material changes and establish improvement measures. After the risk control measures established by the institute, it was found that unsafe behaviors effectively improved the focus of the "gas cylinder replacement operation" in 2017 was reduced from 24 to 8 pieces.

AB - This study uses chemical substances and products for wet etching and dry etching. In the table the etching process hazard analysis is also performed and aimed at the new project of the change system, and completed HAZOP analysis for raw of material changes and establish improvement measures. After the risk control measures established by the institute, it was found that unsafe behaviors effectively improved the focus of the "gas cylinder replacement operation" in 2017 was reduced from 24 to 8 pieces.

KW - 10nm process

KW - Etching process and facility system

KW - Inherently safer design

KW - Risk assessment

UR - http://www.scopus.com/inward/record.url?scp=85062442958&partnerID=8YFLogxK

U2 - 10.1109/IMPACT.2018.8625816

DO - 10.1109/IMPACT.2018.8625816

M3 - 會議論文篇章

AN - SCOPUS:85062442958

T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

SP - 222

EP - 225

BT - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018

PB - IEEE Computer Society

T2 - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018

Y2 - 24 October 2018 through 26 October 2018

ER -

Chen VYC, Chu KC, Chang KC, Horng DJ, Lin JCL. Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency. In 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society. 2018. p. 222-225. 8625816. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT.2018.8625816

Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency

Abstract

Publication series

Conference

Keywords

Access to Document

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Cite this