Study of wafer cleaning process safety using Inherently Safer Design Strategies

Kuo Chi Chang; Kai Chun Chu; Der Juinn Horng; Jerry Chao Lee Lin; Vivien Yi Chun Chen

doi:10.1109/IMPACT.2018.8625796

Study of wafer cleaning process safety using Inherently Safer Design Strategies

Kuo Chi Chang, Kai Chun Chu, Der Juinn Horng, Jerry Chao Lee Lin, Vivien Yi Chun Chen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP. The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36% from 83.75%, improvement of electrical characteristics DC (%) from 6.37% to 6.44, improvement of frequency response (%) from 5.27% down to 4.30%, improvement of stripping ability (%) from 4.47% to 4.20%.

Original language	English
Title of host publication	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Publisher	IEEE Computer Society
Pages	218-221
Number of pages	4
ISBN (Electronic)	9781538656150
DOIs	https://doi.org/10.1109/IMPACT.2018.8625796
State	Published - 2 Jul 2018
Event	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan Duration: 24 Oct 2018 → 26 Oct 2018

Publication series

Name	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume	2018-October
ISSN (Print)	2150-5934
ISSN (Electronic)	2150-5942

Conference

Conference	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Country/Territory	Taiwan
City	Taipei
Period	24/10/18 → 26/10/18

Keywords

Etching process
High-tech process
Inherently safer design
Substitution
Wafer cleaning process

Access to Document

10.1109/IMPACT.2018.8625796

Cite this

Chang, K. C., Chu, K. C., Horng, D. J., Lin, J. C. L., & Chen, V. Y. C. (2018). Study of wafer cleaning process safety using Inherently Safer Design Strategies. In 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 (pp. 218-221). Article 8625796 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2018.8625796

Chang, Kuo Chi ; Chu, Kai Chun ; Horng, Der Juinn et al. / Study of wafer cleaning process safety using Inherently Safer Design Strategies. 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2018. pp. 218-221 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

@inproceedings{596fe25aa50d4c7e9fa5dadfab5aed23,

title = "Study of wafer cleaning process safety using Inherently Safer Design Strategies",

abstract = "The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP. The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36% from 83.75%, improvement of electrical characteristics DC (%) from 6.37% to 6.44, improvement of frequency response (%) from 5.27% down to 4.30%, improvement of stripping ability (%) from 4.47% to 4.20%.",

keywords = "Etching process, High-tech process, Inherently safer design, Substitution, Wafer cleaning process",

author = "Chang, {Kuo Chi} and Chu, {Kai Chun} and Horng, {Der Juinn} and Lin, {Jerry Chao Lee} and Chen, {Vivien Yi Chun}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 ; Conference date: 24-10-2018 Through 26-10-2018",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/IMPACT.2018.8625796",

language = "???core.languages.en_GB???",

series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",

publisher = "IEEE Computer Society",

pages = "218--221",

booktitle = "13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018",

}

Chang, KC, Chu, KC, Horng, DJ, Lin, JCL & Chen, VYC 2018, Study of wafer cleaning process safety using Inherently Safer Design Strategies. in 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018., 8625796, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, vol. 2018-October, IEEE Computer Society, pp. 218-221, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018, Taipei, Taiwan, 24/10/18. https://doi.org/10.1109/IMPACT.2018.8625796

Study of wafer cleaning process safety using Inherently Safer Design Strategies. / Chang, Kuo Chi; Chu, Kai Chun; Horng, Der Juinn et al.
13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2018. p. 218-221 8625796 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Study of wafer cleaning process safety using Inherently Safer Design Strategies

AU - Chang, Kuo Chi

AU - Chu, Kai Chun

AU - Horng, Der Juinn

AU - Lin, Jerry Chao Lee

AU - Chen, Vivien Yi Chun

PY - 2018/7/2

Y1 - 2018/7/2

N2 - The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP. The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36% from 83.75%, improvement of electrical characteristics DC (%) from 6.37% to 6.44, improvement of frequency response (%) from 5.27% down to 4.30%, improvement of stripping ability (%) from 4.47% to 4.20%.

AB - The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP. The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36% from 83.75%, improvement of electrical characteristics DC (%) from 6.37% to 6.44, improvement of frequency response (%) from 5.27% down to 4.30%, improvement of stripping ability (%) from 4.47% to 4.20%.

KW - Etching process

KW - High-tech process

KW - Inherently safer design

KW - Substitution

KW - Wafer cleaning process

UR - http://www.scopus.com/inward/record.url?scp=85062467130&partnerID=8YFLogxK

U2 - 10.1109/IMPACT.2018.8625796

DO - 10.1109/IMPACT.2018.8625796

M3 - 會議論文篇章

AN - SCOPUS:85062467130

T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

SP - 218

EP - 221

BT - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018

PB - IEEE Computer Society

T2 - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018

Y2 - 24 October 2018 through 26 October 2018

ER -

Chang KC, Chu KC, Horng DJ, Lin JCL, Chen VYC. Study of wafer cleaning process safety using Inherently Safer Design Strategies. In 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society. 2018. p. 218-221. 8625796. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT.2018.8625796

Study of wafer cleaning process safety using Inherently Safer Design Strategies

Abstract

Publication series

Conference

Keywords

Access to Document

Fingerprint

Cite this