Study of precision micro-holes in borosilicate glass using micro EDM combined with micro ultrasonic vibration machining

B. H. Yan, A. C. Wang, C. Y. Huang, F. Y. Huang

Research output: Contribution to journalArticlepeer-review

126 Scopus citations


Because of its excellent anodic bonding property and surface integrity, borosilicate glass is usually used as the substrate for micro-electro mechanical systems (MEMS). For building the communication interface, micro-holes need to be drilled on this substrate. However, a micro-hole with diameter below 200 µm is difficult to manufacture using traditional machining processes. To solve this problem, a machining method that combines micro electrical-discharge machining (MEDM) and micro ultrasonic vibration machining (MUSM) is proposed herein for producing precise micro-holes with high aspect ratios in borosilicate glass. In the investigations described in this paper, a circular micro-tool was produced using the MEDM process. This tool was then used to drill a hole in glass using the MUSM process. The experiments showed that using appropriate machining parameters; the diameter variations between the entrances and exits (DVEE) could reach a value of about 2 µm in micro-holes with diameters of about 150 µm and depths of 500 µm. DVEE could be improved if an appropriate slurry concentration; ultrasonic amplitude or rotational speed was utilized. In the roundness investigations, the machining tool rotation speed had a close relationship to the degree of micro-hole roundness. Micro-holes with a roundness value of about 2 µm (the max. radius minus the min. radius) could be obtained if the appropriate rotational speed was employed.

Original languageEnglish
Pages (from-to)1105-1112
Number of pages8
JournalInternational Journal of Machine Tools and Manufacture
Issue number10
StatePublished - Aug 2002


  • Borosilicate glass
  • High aspect ratio
  • Micro electrical-discharge machining
  • Micro ultrasonic vibration machining
  • Micro-hole
  • Micro-tool


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