@inproceedings{d62281cd272c43978ce32906c4c82ad2,
title = "Study of interfacial reactions by Ni/Sn5Ag/Cu sandwich structure",
author = "Tseng, {H. W.} and Liu, {C. Y.}",
year = "2006",
doi = "10.1109/EMAP.2006.4430691",
language = "???core.languages.en_GB???",
isbn = "1424408342",
series = "2006 International Conference on Electronic Materials and Packaging, EMAP",
booktitle = "2006 International Conference on Electronic Materials and Packaging, EMAP",
note = "2006 International Conference on Electronic Materials and Packaging, EMAP ; Conference date: 11-12-2006 Through 14-12-2006",
}