Study of galvanized Sn-finished Ag surface

C. Y. Wu
, K. L. Fu
, Y. X. Lin
, J. Y. Wang
, C. H. Lee
, C. Y. Chiu
, C. Y. Yeh
, B. R. Huang
, J. S. Chang
, C. Y. Liu

Research output: Contribution to journal › Article › peer-review

2 results

Finished
High Efficiency and High Freedom Packaging Technique of Tandem Perovskite Solar Cell(2/3)
Liu, C.-Y. (PI)
1/08/20 → 31/07/21
Project: Research
Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(3/3)
Liu, C.-Y. (PI)
1/08/20 → 31/07/21
Project: Research