Study of Diffusion Barrier for Solder/n-Type Bi₂Te₃ and Bonding Strength for p- and n-Type Thermoelectric Modules

Wen Chih Lin, Ying Sih Li, Albert T. Wu

Department of Chemical and Materials Engineering

Research output: Contribution to journal › Article › peer-review

30 Scopus citations

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Application of Electroless Cobalt Diffusion Barrier on Telluride-Based Low- and Middle- Temperature Range Thermoelectric Module(3/3)
Wu, T.-C. (PI)
1/08/17 → 31/07/18
Project: Research