Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

Wen Chih Lin, Ying Sih Li, Albert T. Wu

Research output: Contribution to journalArticlepeer-review

18 Scopus citations

Fingerprint

Dive into the research topics of 'Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy