Study of Diffusion Barrier for Solder/n-Type Bi₂Te₃ and Bonding Strength for p- and n-Type Thermoelectric Modules

Chemical Compounds

• Diffusion Barrier 85%
• Solder 83%
• Thermoelectricity 75%
• Shear 62%
• Brittle Fracture 49%
• Strength 43%
• Porosity 39%
• Intermetallic Compound 36%
• Surface Chemistry 31%

Engineering & Materials Science

• Diffusion barriers 100%
• Soldering alloys 66%
• Surface chemistry 44%
• Brittle fracture 38%
• Intermetallics 35%
• Strength of materials 35%

Physics & Astronomy

• solders 75%
• modules 56%
• shear 30%
• thermoelectric materials 25%
• barrier layers 24%
• intermetallics 20%