Study of Al-Cu compounds as soldering bond pad for high-power device packaging

Wei Chih Liu, Yan Hao Chen, Te Yuan Chung, Cheng Yi Liu

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Fingerprint

Dive into the research topics of 'Study of Al-Cu compounds as soldering bond pad for high-power device packaging'. Together they form a unique fingerprint.

Keyphrases

Material Science