Solid-liquid interdiffusion bonding between In-coated silver thick films

Jing Chie Lin, Long Wei Huang, Guh Yaw Jang, Sheng Long Lee

Research output: Contribution to journalArticlepeer-review

35 Scopus citations

Abstract

Solid-liquid interdiffusion (SLID) bonding between two pieces of In-coated silver thick films was investigated. The silver thick film was prepared by screen-printing of silver paste on an aluminum oxide substrate. Indium was coated in thickness ranging from 3 to 12 μm onto the silver thick films using thermal deposition (in vacuum). Two pieces of the In-coated thick films were placed in intimate contact (with a compressive stress of 0.04 MPa) and heated (at 180-250 °C) for various durations (600-3600 s) to undergo SLID bonding. Measurement of the bonding strength indicated that the SLID bond in 3-μm-In-coated thick-film couples is stronger than that in 8-μm-In-coated couples. X-Ray diffraction, scanning electron microscopy and electron probe microanalysis were used to analyze the bond. The stronger bond comprises a central zone of γ-Ag2In sandwiched by two Ag films; the weaker bond comprises a central zone of AgIn2 sandwiched by two layers of γ-Ag2In. In the latter case, diffusion of excess indium from the coat into the interface between the silver film and alumina substrates is responsible for bond weakening. The development of microstructures in the SLID process for both strong and weak bonds is proposed.

Original languageEnglish
Pages (from-to)212-221
Number of pages10
JournalThin Solid Films
Volume410
Issue number1-2
DOIs
StatePublished - 1 May 2002

Keywords

  • Ag-In intermetallic compounds
  • Indium coat
  • Silver thick films
  • Solid-liquid interdiffusion bonding

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